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Atomic Force Microscope-Based Lithography of Titanium

Published online by Cambridge University Press:  15 February 2011

A. E. Gordon
Affiliation:
University of Minnesota, Department of Electrical Engineering, 200 Union St. SE., Minneapolis, Minnesota 55455
D. D. Litfin
Affiliation:
University of Minnesota, Department of Electrical Engineering, 200 Union St. SE., Minneapolis, Minnesota 55455
M. S. Hagedorn
Affiliation:
University of Minnesota, Department of Electrical Engineering, 200 Union St. SE., Minneapolis, Minnesota 55455
J. Chen
Affiliation:
University of Minnesota, Department of Electrical Engineering, 200 Union St. SE., Minneapolis, Minnesota 55455
R. T. Fayfield
Affiliation:
University of Minnesota, Department of Electrical Engineering, 200 Union St. SE., Minneapolis, Minnesota 55455
T. K. Higman
Affiliation:
University of Minnesota, Department of Electrical Engineering, 200 Union St. SE., Minneapolis, Minnesota 55455
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Abstract

Anodization of Ti by high electric fields at the tip of a scanned probe can be used to produce nanoscale features consisting of oxides of Ti. In this manner, Ti can be used as a sacrificial resist for nanoscale lithography by exploiting the etching selectivity differences between Ti and anodized Ti. The anodization was accomplished with an atomic force microscope using Ticoated silicon nitride cantilevers. The anodizing bias voltage is applied to the tip and is independent of the feedback, unlike the scanning tunneling microscope. With this setup we were able to fabricate sub-40 nm lines by direct anodization of Ti. It is also shown that once tip and sample are brought into hard contact, subsequent bending of the cantilever has little effect on the linewidth or thickness of the anodized material.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1) Dagata, J.A., Schneir, J., Harary, H.H., Evans, C.J., Postek, M.T., and Bennett, J., Appl. Phys. Lett. 56, 2001 (1990).Google Scholar
2) Lyding, J.W., Shen, T.C., Hubacek, J.S., Tucker, J.R., and Abeln, G.C., Appl. Phys. Lett. 64, 2010 (1994).Google Scholar
3) Snow, E.S. and Campbell, P.M., Appl. Phys. Lett. 64, 1932 (1994).Google Scholar
4) Snow, E.S., Campbell, P.M., and McMarr, P.J., Appl. Phys. Lett. 63, 749 (1993).Google Scholar
5) Minne, S.C., Soh, H.T., Flueckiger, Ph., and Quate, C.F., Appl. Phys. Lett. 66, 703 (1995).Google Scholar
6) Kramer, N., Birk, H., Jorritsma, J., and Schonenberger, C., Appl. Phys. Lett, 66, 1325 (1995).Google Scholar
7) Thundat, T., Nagahara, L.A., Oden, P.I., and Lindsay, S.M., J. Vac. Sci. Technol. A 8, 3537 (1990).Google Scholar
8) Sugimura, H., Uchida, T., Kitamura, N., and Masuhara, H., Jpn. J. Appl. Phys. 32, L553 (1993).Google Scholar
9) Binggeli, M., Mate, C.M., Appl. Phys. Lett. 65, 415 (1994).Google Scholar
10) Young, L., Anodic Oxide Films, (Academic Press, New York, 1961).Google Scholar