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Applications of Laser Annealing in IC Fabrication

Published online by Cambridge University Press:  15 February 2011

L.D. Hess ,
G. Eckhardt ,
S.A. Kokorowski ,
G.L. Olson ,
A. Gupta ,
Y.M. Chi ,
J.B. Valdez ,
C.R. Ito ,
E.M. Nakaji  and
L.F. Lou
L.D. Hess
Affiliation:
Hughes Research Laboratories, Malibu, California, USA
G. Eckhardt
Affiliation:
Hughes Research Laboratories, Malibu, California, USA
S.A. Kokorowski
Affiliation:
Hughes Research Laboratories, Malibu, California, USA
G.L. Olson
Affiliation:
Hughes Research Laboratories, Malibu, California, USA
A. Gupta
Affiliation:
Newport Beach Research Center, Hughes Aircraft Company, Newport Beach, California, USA
Y.M. Chi
Affiliation:
Newport Beach Research Center, Hughes Aircraft Company, Newport Beach, California, USA
J.B. Valdez
Affiliation:
Newport Beach Research Center, Hughes Aircraft Company, Newport Beach, California, USA
C.R. Ito
Affiliation:
Torrance Research Center, Hughes Aircraft Company, Torrance, California, USA
E.M. Nakaji
Affiliation:
Torrance Research Center, Hughes Aircraft Company, Torrance, California, USA
L.F. Lou
Affiliation:
Hughes Research Laboratories, Malibu, California, USA
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Abstract

Laser annealing is discussed in the context of potential applications in the fabrication of advanced solid state components and integrated circuits. General aspects of the uniquetemporal and spatial heating distributions that can be obtained with laser heating are presented, and selected examples are given which illustrate the advantage of special time/temperature heating cycles in the processing of specific semiconductor device structures. The performance of silicon and Hgcdte diodes, polysilicon resistors, multiple stacked polysilicon/oxide capacitors, Al/Si ohmic contacts and MOS/SOS transistors fabricated using laser annealing is significantly improved relative to devices fabricatedusing conventional furnace annealing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 13 , 1982 , 337
Copyright
Copyright © Materials Research Society 1983

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Footnotes

*

Supported in part by U.S. Army ERADCOM, Contract No. DAAK20-80-C-0269.

**

Current Address: Dikewood, A Division of Kaman Sciences Corporation 2716 Ocean Park Blvd. Santa Monica, CA 90405

References

REFERENCES

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