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Annealing of Ion Implantation Damage in SiC Using a Graphite Mask

Published online by Cambridge University Press:  10 February 2011

Chris Thomas
Affiliation:
Materials Science Research Center of Excellence, Howard University, Washington, DC, 20059
Crawford Taylor
Affiliation:
Materials Science Research Center of Excellence, Howard University, Washington, DC, 20059
James Griffin
Affiliation:
Materials Science Research Center of Excellence, Howard University, Washington, DC, 20059
William L. Rose
Affiliation:
Materials Science Research Center of Excellence, Howard University, Washington, DC, 20059
M. G. Spencer
Affiliation:
Materials Science Research Center of Excellence, Howard University, Washington, DC, 20059
Mike Capano
Affiliation:
Purdue University, 1285 Electrical Engineering Bldg., West Lafayette, IN, 47907–1285
S. Rendakova
Affiliation:
TDI, Inc., Gaithersburg, MD, 20877
Kevin Kornegay
Affiliation:
Department of Electrical Engineering, Cornell University, Ithaca, New York, 14853
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Abstract

For p-type ion implanted SiC, temperatures in excess of 1600 °C are required to activate the dopant atoms and to reduce the crystal damage inherent in the implantation process. At these high temperatures, however, macrosteps (periodic welts) develop on the SiC surface. In this work, we investigate the use of a graphite mask as an anneal cap to eliminate the formation of macrosteps. N-type 4H- and 6H-SiC epilayers, both ion implanted with low energy (keV) Boron (B) schedules at 600 °C, and 6H-SiC substrates, ion implanted with Aluminum (Al), were annealed using a Graphite mask as a cap. The anneals were done at 1660 °C for 20 and 40 minutes. Atomic force microscopy (AFM), capacitance-voltage (C-V) and secondary ion mass spectrometry (SIMS) measurements were then taken to investigate the effects of the anneal on the surface morphology and the substitutional activation of the samples. It is shown that, by using the Graphite cap for the 1660 °C anneals, neither polytype developed macrosteps for any of the dopant elements or anneal times. The substitutional activation of Boron in 6H-SiC was about 15%.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

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