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AEM Study of thin and Thick Film Metallization on AIN Substrates

Published online by Cambridge University Press:  21 February 2011

Alistair D. Westwood  and
Michael R. Notis
Alistair D. Westwood
Affiliation:
Department of Materials Science and Engineering, Whitaker Lab #5, Lehigh University, Bethlehem, PA 18015
Michael R. Notis
Affiliation:
Department of Materials Science and Engineering, Whitaker Lab #5, Lehigh University, Bethlehem, PA 18015
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Abstract

Microstructural characterization of thin film (Au-Pt-Ti) and thick film (Mo-Mn) metallization on AIN substrates has been performed using Transmission Electron Microscopy (TEM), Analytical Electron Microscopy (AEM), Convergent Beam Electron Diffraction (CBED) and Auger Electron Spectroscopy (AES). The reaction mechanisms for both types of metallization methods are proposed. In particular, the microchemical and morphological nature of grain boundary penetration and precipitation within the AIN near the metallization interface has been examined.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 331
Copyright
Copyright © Materials Research Society 1988

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References

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