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Advances in Ultrasonic Disk Cutting and Precision Dimpling

Published online by Cambridge University Press:  21 February 2011

Paul E. Fischione ,
Thomas F. Kelly ,
Amber M. Dalley ,
Louis M. Holzman  and
David Dawson-Elli
Paul E. Fischione
Affiliation:
E.A. Fischione Instruments, Inc., Export, PA
Thomas F. Kelly
Affiliation:
University of Wisconsin, Madison, WI
Amber M. Dalley
Affiliation:
RJ Lee Group, Inc., Monroeville, PA
Louis M. Holzman
Affiliation:
University of Wisconsin, Madison, WI
David Dawson-Elli
Affiliation:
University of Wisconsin, Madison, WI
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Abstract

Many of today's advanced materials are prepared using a combination of ultrasonic disk cutting, dimpling, and ion milling. In order to optimize the analytical results from a single specimen, several improvements have been made in instrumentation for ultrasonic disk cutting. Also, a system has been developed for detecting either at or near-electron transparency in TEM specimens. Both of these aspects are described. Examples are provided for silicon, metal/ceramic composites and blanket substrate layers for electronic devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 254: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials III , 1991 , 79
Copyright
Copyright © Materials Research Society 1992

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References

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