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Advances in Liquid Encapsulated Chip-on-Board / MCM-L Technology

Published online by Cambridge University Press:  21 February 2011

Dale L. Robinson  and
David B. Clegg
Dale L. Robinson
Affiliation:
Motorola Inc., MMTG-Final Manufacturing Operations Advanced Packaging Technology 3501 Ed Bluestein Blvd. MD F-25Austin, Tx 78726
David B. Clegg
Affiliation:
Formerly of MCC-Austin
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Abstract

Chip-on-Board technology (COB), or the currently more often used MCM-L acronym (MultiChip Module - Laminate), has long been touted as the low cost, high density electronics packaging choice of the future. Unfortunately, poor reliability performance in comparison to traditional plastic packaging, has been a trademark of COB/MCM-L. Recent advances in processes and materials for COB/MCM-L are providing a paradigm shift in reliability, and providing cost effective high reliability packaging solutions for COB/MCM-L. This paper examines the history of recent advances in liquid encapsulated COB/MCM-L and provides guidelines for selecting appropriate materials and processes for their successful implementation into cost effective manufacturing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 61
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Robinson, Dale, Papageorge, Mark, Naito, Christine, “A New Epoxy Based Liquid Encapsulant with Performance Comparable to Mold Compounds,” IEPS Conference Proceedings, 1993.Google Scholar
2. Robinson, Dale, Higgins, Leo III, “Material Compatibility Issues for Glob Top MCM-L,” IEEE Advanced Materials Workshop, 1993 Google Scholar
3. Wong, C.P., “High Performance Silicone Gel as IC Device Chip Protection,” Materials Research Society Proceedings, 1987.Google Scholar
4. Balde, Jack, “The Effectiveness of Silicone Gels for Corrosion Prevention of Silicon Circuits: The Final Report of the IEEE Computer Society Computer Packaging Committee Special Task Force,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991.Google Scholar
5. Clegg, David, et. al., MCC Technical Report MCC-RwoH-003-95(Q), RwoH Final Technical Report, January 1995 Google Scholar
6. Robinson, Dale, Mammo, Ephraim, Higgins, Leo III, Baum, Joanna, “Glob Top Encapsulation of Large Die on MCM-L,” ISHM MCM Conference Proceedings, and the Microcircuits & Electronic Packaging Special Multichip Module Issue, 1991.Google Scholar
7. Robinson, Dale, Brady, Richard, Higgins, Leo III, “Development of a Low Stress Silicon-Carbide Liquid Encapsulant,” 43rd ECTC Conference Proceedings, June 1993.Google Scholar