Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-24T01:13:55.381Z Has data issue: false hasContentIssue false
  • English
  • Français

Advanced Anodic Bonding Processes For MEMS Applications

Published online by Cambridge University Press:  01 February 2011

V. Dragoi ,
P. Lindner ,
T. Glinsner ,
M. Wimplinger  and
S. Farrens
V. Dragoi
Affiliation:
EV Group, 1 DI Erich Thallner, 4780 - Schaerding, Austria
P. Lindner
Affiliation:
EV Group, 1 DI Erich Thallner, 4780 - Schaerding, Austria
T. Glinsner
Affiliation:
EV Group, 1 DI Erich Thallner, 4780 - Schaerding, Austria
M. Wimplinger
Affiliation:
EV Group Inc, 3701 E. University Drive, Phoenix, AZ 85034, USA
S. Farrens
Affiliation:
EV Group Inc, 3701 E. University Drive, Phoenix, AZ 85034, USA
Get access

Abstract

Anodic bonding is a powerful technique used in MEMS manufacturing. This process is applied mainly for building three-dimensional structures for microfluidic applications or for wafer level packaging. Process conditions will be evaluated in present paper. An experimental solution for bonding three wafers in one single process step (“triple-stack bonding”) will be introduced.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 782: Symposium A – Micro- and Nanosystems , 2003 , A5.80
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Wallis, G. and Pommerantz, D., J. Appl. Phys. 40, 3946 (1969).Google Scholar
2. Cozma, A. and Puers, B., J. Micromech. Microeng. 5, 98 (1995).Google Scholar
3. Kanda, Y., Matsuda, K., Murayama, C. and Sugaya, J., Sensors& Actuators A21–23, 939 (1990).Google Scholar
4. Wei, J., Xie, H., Nai, M. L., Wong, C. K. and Lee, L.C., J. Micromech. Microeng. 13, 217 (2003).Google Scholar
5. Hanneborg, A., Nese, M. and Ohlckers, P., J. Micromech. Microeng. 1, 139 (1991).Google Scholar
6. Rohwer, L. E. S., Oliver, A. D. and Collins, M. V., MRS Proceedings, vol. 729, U5.71 (2001).Google Scholar
7. Quenzer, H. J., Dell, C. and Wagner, B., Proc. of 9thAnnual Intl. Workshop on MEMS - MEMS '96, p. 272, IEEE Proceedings series (1996).Google Scholar
8. Blasquez, G. and Favaro, P., Sensors & Actuators A101, 156 (2002).Google Scholar
9. Baier, V., Gebhardt, A. and Barth, S., MRS Proc. vol 681E I5.1.1 (2001).Google Scholar