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Adhesion of Tungsten Fine Lines on SiO2 by Micro-Wedge Scratching

Published online by Cambridge University Press:  21 February 2011

M. P. de Boer
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
H. Huang
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
J. C. Nelson
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
F. Wang
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
W. W. Gerberich
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
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Abstract

Microscratch testing of thin films has mainly been done with a conical tip. In the wedge scratch technique introduced in this paper, thin film fine lines are scratched by a wedge-shaped diamond tip until a spallation occurs. A near plane strain situation arises, and finite element method (FEM) analysis is applied for more accurate evaluation of the work of adhesion. The material system used to demonstrate the micro-wedge scratch technique is rf-sputtered tungsten on thermally grown SiO2. When scratching a long line, delamination occurs by two mechanisms. At loads above 8-9mN/µm (normal load per unit line width), tensile stresses behind the indenter tip cause the tungsten to crack, and the thin film subsequently curls up. At loads above 1lmN/µm, high shear stresses in front of the indenter cause delamination of the tungsten at the interface. This latter event is modeled by FEM using a bimaterial fracture mechanics approach to obtain a practical work of adhesion value.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

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