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Adhesion and Young's Modulus of CVD Diamond Thin Films Grown Over Various Substrates

Published online by Cambridge University Press:  15 February 2011

R. Ramesham ,
R. F. Askew  and
M. F. Rose
R. Ramesham
Affiliation:
Space Power Institute, 231 Leach Center, Auburn University, Auburn, AL 36849-5320.
R. F. Askew
Affiliation:
Space Power Institute, 231 Leach Center, Auburn University, Auburn, AL 36849-5320.
M. F. Rose
Affiliation:
Space Power Institute, 231 Leach Center, Auburn University, Auburn, AL 36849-5320.
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Abstract

Diamond films were deposited by microwave plasma CVD using H2 and CH4 gas mixture over various substrate materials such as Si, Pd, Be, Cu, Mo, AIN, SiO2, Si3N4, Al2O3, Sapphire, Quartz, Ni-base alloys, single crystal Ni, boron nitride, and Ti. We have used a Z-axis pull stud test to determine adhesion strength of diamond film to some of the substrates. Our observations on the adhesion of diamond films to the above substrates are reported. A method will be described to evaluate Young's modulus of CVD diamond films using fabricated diamond cantilever beams.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 383: Symposium I – Mechanical Behavior of Diamond and Other Forms of Carbon , 1995 , 217
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Peebles, D.E. and Pope, L.E., J. Mater. Res., 5, 2589, 1990.Google Scholar
2. Alam, M., Peebles, D., and Tallant, D., Electrochemical Society Spring Meeting, Extended Abstracts, 91 (1), 151, 1991.Google Scholar
3. Kuo, C.T., Yen, T.Y., and Huang, T.H., J. Mater. Res., 5, 2515, 1990.Google Scholar
4. Davidson, J.L., Ellis, C., and Ramesham, R., J. Electron. Mater., 18, 711, 1989.Google Scholar
5. Ramesham, R., Roppel, T., Ellis, C., Jaworske, D.A., and Baugh, W., J. Mater. Res., 6, 1278, 1991.Google Scholar
6. Ramesham, R. and Roppel, T., J. Mater. Res., 7, 1144, 1992.Google Scholar
7. Ramesham, R., Roppel, T., Johnson, R.W., Chang, J.M., Thin Solid Films, 212,96, 1992.Google Scholar
8. Davidson, J.L., Ramesham, R., Ellis, C., J. Electrochem. Soc., 137, 3206, 1990.Google Scholar
9. Nash, W.A., in “Theory and problems of Strength of Materials,” 2nd Edition, p. 169, McGraw Hill Book Company, New York (1972).Google Scholar