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Temperature Dependence Of Residual Stresses In Capped Blanket Cu Films Of Various Thicknesses

Published online by Cambridge University Press:  15 February 2011

G. Langelaan ,
S. Saimoto  and
M. Moske
G. Langelaan
Affiliation:
Department of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada
S. Saimoto
Affiliation:
Department of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada
M. Moske
Affiliation:
Insitut für Physik, Universitat Augsburg, Augsburg, Germany
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Abstract

Residual strains in thin films of 1.0 μm, 0.5 μm and 0.25 μm Cu capped with 24 nm Ta and a 62 nm Ta diffusion barrier were measured using x-rays during continuous temperature ramping. Cycles up to 300°C and 400°C were performed. At ambient temperature, the flow stresses after heating to 400°C were found to increase wth decreasing film thickness. The stresses were sufficiently high below 100°C to cause plastic yielding. The diffracted intensities from the in-plane and out-of-plane (111) planes were recorded with temperature and the intensity changes were attributed to the necessary dislocation density and distribution variation to accomodate the mismatch strain due to thermal expansion differences.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 428: Symposium L – Materials Reliability in Microelectronics VI , 1996 , 537
Copyright
Copyright © Materials Research Society 1996

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References

1. Flinn, P.A., Gardner, D.S. and Nix, W.D., IEEE Transactions on Electron Devices ED–343 689–694 (1987)Google Scholar
2. Clarke, A.P., Saimoto, S. and Ho, P., Stress Induced Phenomena in Metallization ed. Ho, P.S., Li, C-Y. and Totta, P., AIP Press, New York, 125–136 (1994).Google Scholar
3. Clarke, A.P., Ph. D.Thesis, Queen's University, (1993).Google Scholar
4. Clarke, A.P., Langelaan, G., and Saimoto, S.: inThin FilmsStresses and Mechanical Properties V, editors, Baker, S.P., Ross, C.A., Townsend, P.H., Volkert, C.A. and Borgesen, P. (MRS vol. 356, 1995), 609–614.Google Scholar
5. Noyan, I.C. and Cohen, J.B., Residual Stress Measurements by Diffraction and Interpretation, (Springer-Verlag, New York, 1987).Google Scholar
6. Korhonen, M.A. and Paszkiet, C.A., Scripta Metlall. 23, 1449–1454 (1989).Google Scholar
7. Frost, H.S. and Ashby, M.F., Deformation-Mechanisms Maps, (Pergamon Press, Oxford, 1982).Google Scholar
8. Mitra, G.B. and Mitra, S.K., Ind. J. Phys, 37, 462–472 (1963).Google Scholar
9. Simmons, R.O. and Balluffi, R.W., Phys. Rev., 129, 1533–1544 (1963).Google Scholar
10. Balluffi, R.W., J. Nuc. Mat., 69–70, 240–263 (1978).Google Scholar
11. Keller, R.M., Bader, B., Vinci, R.P. and Arzt, E. in Thin Films: Stresses and Mechanical Properties V, editors, Baker, S.P., Ross, C.A., Townsend, P.H., Volkert, C.A. and Borgescn, P. (MRS vol. 356, 1995), pp453–458 Google Scholar
12. Thouless, M.D., Gupta, J. and Harper, J.M.E., J.Mater. Res. 8, 1845 (1993).Google Scholar
13. Vinci, R.P., Zielinski, E.M. and Bravman, J.C., in Thin Films: Stresses and Mechanical Properties V, editors, Baker, S.P., Ross, C.A., Townsend, P.H., Volkert, C.A. and Borgesen, P. (MRS vol. 356, 1995), pp459–464.Google Scholar
14. Zielinski, E.M., Vinci, R.P. and Bravman, J.C., ibid, pp429–434.Google Scholar
15. Cullity, B.D., Elements of X-Ray Diffraction, (Addison-Wesley, 1978) p269.Google Scholar