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TEM and Electrical Analysis of Sputtered Barium Strontium Titanate (BST) Thin Films on Flexible Copper Substrates

Published online by Cambridge University Press:  01 February 2011

Brian Laughlin ,
Jon Ihlefeld  and
Jon-Paul Maria
Brian Laughlin
Affiliation:
Institute for Electroceramic Thin Films, Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695, U.S.A.
Jon Ihlefeld
Affiliation:
Institute for Electroceramic Thin Films, Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695, U.S.A.
Jon-Paul Maria
Affiliation:
Institute for Electroceramic Thin Films, Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695, U.S.A.
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Abstract

Ba0.6Sr0.4TiO3 (BST) films were deposited on copper foils by radio frequency magnetron sputtering. These films will be an integral part of flexible capacitor sheets intended for space borne re-configurable antenna arrays. By the use of controlled pO2 high temperature anneals, the films were fully crystallized in the absence of substrate oxidation. X-ray diffraction and transmission electron microscopy (TEM) showed no existence of copper oxidation (i.e. Cu2O or CuO phases). The deposited BST films exhibit a high permittivity (625) and a low tan δ (0.020) at zero bias and room temperature. A pronounced electrical tunability ratio of 3.5:1 is observed on these devices. Devices show loss tangents as low as 0.003 in fields approaching 400 kV/cm. Electrical field calculations are based on cross-sectional atomic force microscopy (AFM) images that reveal a film thickness of 800 nm. Temperature dependent measurements show a Tmax ∼ 230 K with a diffuse dielectric anomaly. Transmission electron microscopy (TEM) and atomic force microscopy (AFM) analyses indicate a conformal film with a mixed grain morphology and an abrupt Cu/BST interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 784: Symposium C – Ferroelectric Thin Films XII , 2003 , C5.3
Copyright
Copyright © Materials Research Society 2004

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