Skip to main content Accessibility help
×
Home
Hostname: page-component-5cfd469876-rgz9k Total loading time: 0.164 Render date: 2021-06-23T19:29:24.576Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true }

Synthesis of Model Alumina Slurries for Damascene Patterning of Copper

Published online by Cambridge University Press:  18 March 2011

Byung-Chan Lee
Affiliation:
Center for Integrated Electronics and Electronics Manufacturing, Rensselaer Polytechnic Institute Troy, NY 12180, U.S.A.
David J. Duquette
Affiliation:
Center for Integrated Electronics and Electronics Manufacturing, Rensselaer Polytechnic Institute Troy, NY 12180, U.S.A.
Ronald J. Gutmann
Affiliation:
Center for Integrated Electronics and Electronics Manufacturing, Rensselaer Polytechnic Institute Troy, NY 12180, U.S.A.
Get access

Abstract

Model alumina slurries for chemical-mechanical planarization (CMP) of copper have been studied using fundamental electrochemical concepts together with modification of surface tension and zeta-potential. A model slurry was established containing 3 wt% alumina (50 nm nominal size), 2 wt% potassium dichromate (K2Cr2O7) and 1 vol % DOWFAX, as abrasive, oxidizer and anionic surfactant, respectively, which resulted in blanket copper removal rates of 130 nm/min with smooth, low-particulate defect density surfaces without aggressive post-CMP cleaning. When used with a model silica-abrasive slurry to remove the Ta liner, well-defined damascene-patterned structures were achieved with low-particulate defect densities.

Open circuit potential measurement, potentiodynamic polarization, surface tension measurement, and zeta-potential measurement were used in developing the model slurries. The variations obtained with alternative abrasives, alternative oxidizers and alternative surfactants illustrate the principles of synthesizing slurries for Cu and Ta.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below.

References

1. Huynh, C., Rutten, M., Cheek, R., Linde, H., IEEE/SEMI Advanced Semiconductor, Manufacturing Conference Digest, p. 372 (1998).Google Scholar
2. Li, S.H., Miller, R.O., Chemical Mechanical Polishing in Silicon Processing, (Academic Press, 2000) p. 207.Google Scholar
3. Steigerwald, J. M., Murarka, S. P., and Gutmann, R. J., Chemical Mechanical Planarization of Microelectronic Materials, (John Wiley & Sons, Inc., 1997) p. 140, p. 189, p. 224.10.1002/9783527617746CrossRefGoogle Scholar
4. Kaufman, F. B., Thompson, D.B., Broadie, R.E., Jaco, M.A., Guthrie, W.L., Pearson, D.J., and Small, M.B., J. Electrochem. Soc., 138 (11), 3460 (1991).10.1149/1.2085434CrossRefGoogle Scholar
5. Lee, B.C., Wang, B., Duquette, D.J., Gutmann, R.J., CMP-MIC Conference digest, p. 47 (2000).Google Scholar
6. Jones, D.A., Corrosion, 2nd edition, (Prentice Hall, 1996) p. 60.Google Scholar
7. Pourbaix, M., Atlas of electrochemical equilibria in aqueous solutions, (National Association of Corrosion Engineering, 1974) p. 252, p 261, p. 384.Google Scholar
8. Feng, Y., Siow, K. S., Teo, W. K., Tan, K. L., Hsieh, A. K., Corrosion, 53, 389 (1997).CrossRefGoogle Scholar
9. Parks, G. A., Chem. Rev., 65, 177 (1965).10.1021/cr60234a002CrossRefGoogle Scholar
10. Bard, A.J., Parsons, R., Jordan, J., Standard Potentials in Aqueous Solution, (Marcel Dekker, Inc. New York, 1985) p. 89.Google Scholar
11. Lee, T.S., Corrosion, 39, 371 (1983).10.5006/1.3579287CrossRefGoogle Scholar
12. Bahadur, A., J. Mater Sci & Eng, 17, 701 (1998).Google Scholar
13. Hunter, R.J., Foundations of Colloid Science, Vol. I, (Oxford University Press, New York, 1989) p.341.Google Scholar
14. Tadros, Th.F., Solid/Liquid Dispersions, (Academic Press Inc., London, 1987) p.77.Google Scholar
15. Rosen, M.J., Surfactants and Interfacial Phenomena, 2nd edn, (John Wiley & Sons, 1989) p. 7.Google Scholar
16. Shaw, D.J., Introduction to Colloid and Surface Chemistry, (Butterworth & Co Publishers Ltd., 1980) p.80.Google Scholar
17. Bowling, R. A., J. Electrochem. Soc., 132, 2208 (1985).CrossRefGoogle Scholar
18. Lee, B.C., Ph.D Thesis, Rensselaer Polytechnic Institute, (2000) p. 143.Google Scholar
19. Mahulikar, D., Pasqualoni, A., CMP-MIC Conference Digest, p. 221 (1999).Google Scholar
20. Yang, K., CMP-MIC Conference Digest, p. 23 (2000).Google Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Synthesis of Model Alumina Slurries for Damascene Patterning of Copper
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Synthesis of Model Alumina Slurries for Damascene Patterning of Copper
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Synthesis of Model Alumina Slurries for Damascene Patterning of Copper
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *