Skip to main content Accessibility help
×
Home
Hostname: page-component-768ffcd9cc-7jw6s Total loading time: 0.187 Render date: 2022-11-30T15:23:16.430Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "useRatesEcommerce": false, "displayNetworkTab": true, "displayNetworkMapGraph": false, "useSa": true } hasContentIssue true

A Study of Atomic Layer Deposition and Reactive Plasma Compatibilitywith Mesoporous Organosilicate Glass Films

Published online by Cambridge University Press:  01 February 2011

E. Todd Ryan
Affiliation:
Advanced Micro Devices, 1 AMD Place, Sunnyvale, CA 94088
Melissa Freeman
Affiliation:
Motorola, APRDL, 3501 Ed Bluestein Blvd., Austin, TX 78721
Lynne Svedberg
Affiliation:
Motorola, APRDL, 3501 Ed Bluestein Blvd., Austin, TX 78721
J.J. Lee
Affiliation:
Motorola, APRDL, 3501 Ed Bluestein Blvd., Austin, TX 78721
Todd Guenther
Affiliation:
Motorola, APRDL, 3501 Ed Bluestein Blvd., Austin, TX 78721
Jim Connor
Affiliation:
Motorola, APRDL, 3501 Ed Bluestein Blvd., Austin, TX 78721
Katie Yu
Affiliation:
Motorola, APRDL, 3501 Ed Bluestein Blvd., Austin, TX 78721
Jianing Sun
Affiliation:
University of Michigan, Department of Physics, Ann Arbor, MI, 48109
David W. Gidley
Affiliation:
University of Michigan, Department of Physics, Ann Arbor, MI, 48109
Get access

Abstract

The compatibility of ALD and CVD metal deposition with mesoporous and microporous carbon-doped organosilicate glass (OSG) films was examined. Blanket film studies using TEM, TOF-SIMS, and positron lifetime spectroscopy demonstrate that ALD Wand TaN penetrate deep into the mesoporous film via the film's connected pore structure. In contrast, metal penetration into microporous OSG films was not observed. He and NH3 plasma pretreatments to the mesoporous OSG film surface did not seal the mesopores to ALD metal penetration, but the plasmas did damage the bulk of the mesoporous OSG film with varying severity. The results indicate that porosity, pore size, and/or pore structure regulate ALD/CVD precursor diffusion and that ALD metal deposition is a good probe of pore sealing strategies.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Lee, W.W. and Ho, P.S.. MRS Bulletin, 22, 19 (1997).CrossRefGoogle Scholar
2. Rossnagel, S.M. and Kim, H., Proceedings of the IEEE 2001 International Interconnect Technology Conference, 3-5 (2001).Google Scholar
3. Gidley, D.W., Frieze, W.E., Dull, T.L., Yee, A.F., Ho, H.M., and Ryan, E.T.. Phys. Rev. B, 60(8), R5157 (1999).CrossRefGoogle Scholar
4. Ryan, E.T., Martin, J., Junker, K., Wetzel, J., Sun, J.N., and Gidley, D.W.. J. Mat. Res. 16(12), 3335 (2001).CrossRefGoogle Scholar
5. Sun, J.N., Gidley, D.W., Hu, Y., Frieze, W.E., Ryan, E.T.. Appl. Phys. Lett. 81(8), 1447 (2002).CrossRefGoogle Scholar
6. Ryan, E.T., Martin, J., Junker, K., Lee, J.J., Guenther, T., Wetzel, J., Lin, S., Gidley, D.W., Sun, J.. Proceedings of the IEEE 2002 International Interconnect Technology Conference, 27 (2002).Google Scholar
7. Chang, T.C., Liu, P.T., Mor, Y.S., Sze, S.M., Yang, Y.L., Feng, M.S., Pan, F.M., Dai, B.T., and Chang, C.Y., J. Electrochem. Soc. 146(10), 3802 (1999).CrossRefGoogle Scholar
8. Liu, P.T., Chang, T.C., Yang, Y.L., Cheng, Y.F., and Sze, S.M., IEEE Trans. Elect. Dev. 47(9), 1733 (2000).Google Scholar
9. Besling, W., et al. Proceedings of the IEEE 2002 International Interconnect Technology Conference, 288 (2002); T. Abell, et al. AMC 2002, to be published.Google Scholar
10. Sun, J.N., Gidley, D.W., Dull, T.L., Frieze, W.E., Yee, A.F., Ryan, E.T., Lin, S., and Wetzel, J.. J. Appl. Phys., 89(9), 5138 (2001).CrossRefGoogle Scholar
11. Gidley, D.W., Frieze, W.E., Dull, T. L., Sun, J.N., and Yee, A.F.. Mater. Res. Soc. Symp. Proc. 612, 2000, D4.3.1. CrossRefGoogle Scholar
12.A detailed analysis of the PALS data is in progress for a later publication.Google Scholar

Save article to Kindle

To save this article to your Kindle, first ensure coreplatform@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about saving to your Kindle.

Note you can select to save to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

A Study of Atomic Layer Deposition and Reactive Plasma Compatibilitywith Mesoporous Organosilicate Glass Films
Available formats
×

Save article to Dropbox

To save this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Dropbox account. Find out more about saving content to Dropbox.

A Study of Atomic Layer Deposition and Reactive Plasma Compatibilitywith Mesoporous Organosilicate Glass Films
Available formats
×

Save article to Google Drive

To save this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Google Drive account. Find out more about saving content to Google Drive.

A Study of Atomic Layer Deposition and Reactive Plasma Compatibilitywith Mesoporous Organosilicate Glass Films
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *