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Studies on Ion Scattering and Sputtering Processes Relevant to Ion Beam Sputter Deposition of Multicomponent Thin Films

Published online by Cambridge University Press:  25 February 2011

O. Auciello ,
M. S. Ameen ,
A. R. Krauss ,
A. I. Kingon  and
M. A. Ray
O. Auciello
Affiliation:
N. C. State University, Department of Materials Science and Engineering, Raleigh, NC 27695 Microelectronics Center of North Carolina, Research Triangle Park, NC 27709–2 889
M. S. Ameen
Affiliation:
N. C. State University, Department of Materials Science and Engineering, Raleigh, NC 27695
A. R. Krauss
Affiliation:
Argonne National Laboratory, Chemistry Division, Argonne, IL 36409
A. I. Kingon
Affiliation:
N. C. State University, Department of Materials Science and Engineering, Raleigh, NC 27695
M. A. Ray
Affiliation:
Argonne National Laboratory, Chemistry Division, Argonne, IL 36409
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Abstract

Results from computer simulation and experiments on ion scattering and sputtering processes in ion beam sputter deposition of high Tc superconducting and ferroelectric thin films are presented. It is demonstrated that scattering of neutralized ions from the targets can result in undesirable erosion of, and inert gas incorporation in, the growing films, depending on the ion/target atom mass ratio and ion beam angle of incidence/target/substrate geometry. The studies indicate that sputtering by Kr+ or Xe+ ions is preferable to the most commonly used Ar+ ions, since the undesirable phenomena mentioned above are minimized for the first two ions. These results are used to determine optimum sputter deposition geometry and ion beam parameters for growing multicomponent oxide thin films by ion beam sputter-deposition.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 157: Symposium A – Beam-Solid Interactions: Physical Phenomena , 1989 , 287
Copyright
Copyright © Materials Research Society 1990

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References

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