Skip to main content Accessibility help
×
Home
Hostname: page-component-cf9d5c678-w9nzq Total loading time: 0.376 Render date: 2021-08-03T05:36:27.160Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true, "newUsageEvents": true }

Stress behavior of CVD-PSG Films Depending on Deposition Methods and Hillock Suppression

Published online by Cambridge University Press:  21 February 2011

Eungsoo Kim
Affiliation:
Micro Process Development Team, Semiconductor R & D Center Samsung Electronics Co. 82–3 Dodang-Dong, Wonmi-Gu, Buchun, Kyunggi-Do, 421–130, Korea
Suk-Hee Kang
Affiliation:
Micro Process Development Team, Semiconductor R & D Center Samsung Electronics Co. 82–3 Dodang-Dong, Wonmi-Gu, Buchun, Kyunggi-Do, 421–130, Korea
Soon-Kwon Lim
Affiliation:
Micro Process Development Team, Semiconductor R & D Center Samsung Electronics Co. 82–3 Dodang-Dong, Wonmi-Gu, Buchun, Kyunggi-Do, 421–130, Korea
Get access

Abstract

In multilevel metallization processes, stress induced void and hillock formations cause serious problems with respect to the reliability of metal line, such as pitting corrosion of metal during the pad etching step, mask misalignment due to surface roughness, and open or short failure of metal line. It is generally known that these types of metal-film related problems are due to stress relaxation process in the metal line stress-induced by thermal expansion mismatch between metal and over/underlayer oxide film or compressive stress of overlayered passivation dielectric film.

In this study, the stress behavior of phosphosilicate glass (PSG) film on the Al-l%Si film, deposited by different CVD methods, is investigated. Here we found that the degree of PSG film stress is related with the suppression of hillock growth, void formation, and cracking of passivation layer, depending on the heat treatment and heat treatment. Using stress measurement, surface profilometer, and SEM, the relation between passivated PSG film stress on metal line and the metal line failures is analyzed. In addition, an effective method of hillock suppression is suggested, which is the use of PECVD-PSG film on the metal line before heat treatment of 400°C or that of any type of PSG film before 350°C.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Murarka, S.P., Metallization: Theory and Practice for VLSI and ULSI. (Butterworth-Heinemann, Boston, 1993), p. 231.Google Scholar
2. Kamei, Y., Kameda, M., and Nakayama, H., IDEM 84, 138141 (1984).Google Scholar
3. Brown, A.A., The Proceedings of the 4th international IEEE VMIC. Santa Clara, pp. 426433, 1987 Google Scholar
4. Learn, A.J., J. Vac. Sci. Technol. B4, 774 (1986).CrossRefGoogle Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Stress behavior of CVD-PSG Films Depending on Deposition Methods and Hillock Suppression
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Stress behavior of CVD-PSG Films Depending on Deposition Methods and Hillock Suppression
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Stress behavior of CVD-PSG Films Depending on Deposition Methods and Hillock Suppression
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *