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Signal Amplification and Leakage Current Suppression in Amorphous Silicon P-I-N Diodes by Field Profile Tailoring

Published online by Cambridge University Press:  15 February 2011

W.S. Hong
Affiliation:
Physics Division and EngineeringDivision, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, U.S.A.
A. Mireshghi
Affiliation:
Sharif University, Tehran, Iran
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Abstract

The performance of amorphous silicon p-i-n diodes as radiation detectors in terms of signal amplitude can be greatly improved when there is a built-in signal gain mechanism. We describe an avalanche gain mechanism which is achieved by introducing stacked intrinsic, p-type, and n-type layers into the diode structure. We replaced the intrinsic layer of the conventional p-i-n diode with i1-p-i2-n-i3 multilayers. The i2 layer (typically 1~3 μm) achieves an electric field > 106 V/cm, while maintaining the p-i interfaces to the metallic contact at electric fields < 7 × 104 V/cm, when the diode is fully depleted. For use in photo-diode applications the whole structure is less than 10 μm thick. Avalanche gains of 10~50 can be obtained when the diode is biased to ~500 V. Also, dividing the electrodes to strips of 2 μm width and 20 μm pitch reduced the leakage current up to an order of magnitude, and increased light transmission without creating inactive regions.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

[1] Chevrier, J.B. and Equer, B., J. Appl. Phys. 76 p.7415 (1994)Google Scholar
[2] Fujieda, I., Cho, G., Conti, M., Drewery, J., Kaplan, S., Perez-Mendez, V., Qureshi, S. and Street, R., IEEE Trans. Nucl. Sci., 37 p.124 (1990)Google Scholar
[3] Jwo, S., Wu, M., Fang, Y., Chen, Y., Hong, J., Chang, C., IEEE Trans. Elec. Dev., 35 p.1279 (1988)Google Scholar
[4] Hong, J., Laih, W., Chen, Y., Fang, Y., Chang, C., Gong, J., IEEE Trans. Elec. Dev., 37 p. 1804 (1990)Google Scholar
[5] Jing, T., Drewery, J.S., Hong, W.S., Lee, H., Kaplan, S.N., Mireshghi, A., Perez-Mendez, V., SPIE Proc., Vol. 2366 p.345 (1994)Google Scholar
[6] Hong, W.S., Drewery, J.S., Jing, T., Lee, H.-K., Kaplan, S.N., Mireshghi, A. and Perez-Mendez, V., Nucl. Instr. Meth., A356 p.239 (1995)Google Scholar
[7] Mireshghi, A., Hong, W.S., Drewery, J., Jing, T., Kaplan, S.N., Lee, H.K. and Perez-Mendez, V., MRS Symp. Proc., Vol. 336 p.377 (1994)Google Scholar
[8] Oed, A., Nucl. Instr. Meth., A263 p.351 (1988)Google Scholar