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A saw Sensor Study of the Relative Adhesion and Surface Properties of Polyimide Films

Published online by Cambridge University Press:  22 February 2011

D. W. Galipeau ,
C. Feger  and
J. F. Veteldmo
D. W. Galipeau
Affiliation:
Laboratory for Surface Science and Technology and Department of Electrical Engineering, University of Maine, Orono. ME 04469
C. Feger
Affiliation:
IBM T. J. Watson Research Center, Room 39–114, P.O.Box 218, Yorktown Heights. NY 10598
J. F. Veteldmo
Affiliation:
Laboratory for Surface Science and Technology and Department of Electrical Engineering, University of Maine, Orono. ME 04469
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Abstract

A surface acoustic wave (SAW) sensor is used to study the relative humidity response of polyimide films where interfacial and surface properties are varied. The relationship between these responses and the relative adhesion strength of these films is of particular interest since it could have application as a nondestructive, quantitative measure of adhesion strength. The results show clear differences in the SAW humidity response for cured and uncured films. There are also significant differences in the SAW humidity response for films applied with and without adhesion promoter. In addition the humidity response has proven to be particularly sensitive to the surface treatment of the polyimide film. These results suggest applications of the SAW sensor as a cure indicator, an in-situ sensor for the monitoring of film surface properties in process control applications and as an adhesion sensor.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 617
Copyright
Copyright © Materials Research Society 1992

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References

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