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Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films

Published online by Cambridge University Press:  10 February 2011

Michelle Chen
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
Suraj Rengarajan
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
Peter Hey
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
Yezdi Dordi
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
Hong Zhang
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
Imran Hashim
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
Peijun Ding
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
Barry Chin
Affiliation:
Metal Deposition Product Business Group, Electra Copper Program Applied Materials, Santa Clara, CA 95054
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Abstract

Self-annealing properties of electroplated and sputtered copper films at room temperature were investigated in this study, in particular, the effect of copper film thickness, electrolyte systems used, as well as their level of organic additives for electroplating. Real-time grain growth was observed by transmission electron microscopy. Sheet resistance and X-ray diffraction measurements further confirmed the recrystallization of the electroplated copper film with time. The recrystallization of electroplated films was then compared with that of sputtered copper films.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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Room Temperature Self-Annealing of Electroplated and Sputtered Copper Films
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