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Recrystallization Characteristics of Amorphous Si

Published online by Cambridge University Press:  26 February 2011

Rodney A. Herring
Affiliation:
Martin Marietta Laboratories, 1450 South Rolling Road, Baltimore, MD 21227-3839.
Eric M. Fiore
Affiliation:
Martin Marietta Laboratories, 1450 South Rolling Road, Baltimore, MD 21227-3839.
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Abstract

The microstructure of high-energy (0.5–6.0 MEV) As-ion implanted Si and rapid thermal annnealed (RTA'd) Si has been studied by transmission electron microscopy (TEM). The implantations formed buried amorphous layers that recrystallized during RTA at different temperatures and became either single crystal or polycrystalline depending on their implation energy and fluence. At energies > 2.5 MeV and fluences < 1015 cm−2, recrystallization occurred below 400°C and regowth was single crystal. At an energy of 6 MeV and fluence of 5 × 1015 cm−2 recrystallization occurred above 600°C and regrowth was polycrystalline. When the implantation energy and fluence were reduced to 0.5 MeV and 2 × 1014 cm−2, respectively, recrystallization occurred above 600°C and regrowth was polycrystalline. The above results are explained by both the formation mechanisms of amorphous Si resulting from ion implantation and the structural order of a-Si.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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References

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