Hostname: page-component-5c6d5d7d68-vt8vv Total loading time: 0.001 Render date: 2024-08-11T02:49:43.496Z Has data issue: false hasContentIssue false
  • English
  • Français

The Origin of Stress in Co-Cr Alloy Thin Films Deposited by Magnetron Sputtering

Published online by Cambridge University Press:  22 February 2011

Zhi-Feng Zhou  and
Yu-Dian Fan
Zhi-Feng Zhou
Affiliation:
Foshan Ceramics Research Institute, Foshan City, Guangdong 528031, CHINA.
Yu-Dian Fan
Affiliation:
Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, CHINA.
Get access

Abstract

Co-Cr alloy thin films are considered as an applicable perpendicular magnetic recording medium, and their mechanical properties such as internal stress can not be neglected. In this experiment, Co-Cr films are deposited on glass substrates by D. C planar magnetron sputtering, and the effects of film thickness, Ni-Fe underlayer as well as substrate temperature on the stress are studied respectively. The stresses are all tensile in all cases, and the stress existing at the film-substrate interface is very small. According to the above experimental results and the structure analysis of the films, the atomic peening effect produced by the rebounded working gas atoms can be negligible, and the stress is thought to originate from the film growth process but not from the inter-facial effect. Therefore, the structural defect elimination model is proposed (here the defects mainly include vacancies and grain boundaries). With this model, the origin of the tensile stress as well as the relations between the stress and the deposition conditions are explained qualitatively.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 63
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ouchi, K. and Iwasaki, S., IEEE Trans. Magn. MAG–23, 2443 (1987).Google Scholar
2. Zhou, Z. F. and Fan, Y. D., in Thin Films and Beam-Solid Interactions (Chinese Mater. Res. Soc. Proc.4, Beijing, 1990) pp. 241–245.Google Scholar
3. Zhou, Z. F. and Fan, Y. D., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A. (Mater. Res. Soc. Proc. 130, Pittsburgh, PA 1988) pp. 383–388.Google Scholar
4. Simpson, E. M., Curland, N. and Matz, R. T., IEEE Trans. Magn. MAG–21, 1450 (1985).Google Scholar
5. Nakagawa, S., Sumide, M., Kitamoto, Y., Niimura, Y. and Naoe, M., J. Appl. Phys. 63, 2911 (1988).Google Scholar
6. Klokholm, E. and Berry, B. S., J. Electrochem. Soc. 115, 823 (1968).CrossRefGoogle Scholar
7. Doljack, F. A. and Hoffman, R. W., Thin Solid Films 12, 71 (1972).CrossRefGoogle Scholar
8. Springer, R. W. and Hoffman, R. W., J. Vac. Sci. Technol. 1, 238 (1973).CrossRefGoogle Scholar
9. Chaudhari, P., J. Vac. Sci. Technol. 9, 520 (1972).CrossRefGoogle Scholar
10. Hwang, U., Uchiyama, Y., Ishibashi, K. and Suzuki, T., Thin Solid Films 147. 231 (1987).Google Scholar
11. Howard, J. K., J. Vac. Sci. Technol. A4, 2975 (1986).Google Scholar
12. Glocker, D. A., Yetter, W. E. and Gau, J.-S., IEEE Trans. Magn. MAG–22, 331 (1986).Google Scholar
13. Lee, J.-W., Demczik, B. G., Mountfield, K. R. and Laughlin, D. E., IEEE Trans. Magn. MAG–23, 2455 (1987).CrossRefGoogle Scholar
14. Futamoto, M., Honda, Y., Kakibayashi, H. and Yoshida, K., IEEE Trans. Magn. MAG–21, 1426 (1985).CrossRefGoogle Scholar