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Nanoparticle Enhanced Solders for Increased Solder Reliability

Published online by Cambridge University Press:  10 May 2012

Omid Mokhtari
Affiliation:
Department of Physics, King’s College London, London, UK
Ali Roshanghias
Affiliation:
Department of Mechanical Engineering, King’s College London, London, UK
Roya Ashayer
Affiliation:
Department of Mechanical Engineering, King’s College London, London, UK
Hiren R Kotadia
Affiliation:
Department of Physics, King’s College London, London, UK
Farzad Khomamizadeh
Affiliation:
Department of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran
Amir H Kokabi
Affiliation:
Department of Materials Science and Engineering, Sharif University of Technology, Tehran, Iran
Michael P Clode
Affiliation:
Department of Mechanical Engineering, King’s College London, London, UK
Mark Miodownik
Affiliation:
Department of Physics, King’s College London, London, UK
Samjid H Mannan
Affiliation:
Department of Physics, King’s College London, London, UK
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Abstract

Due to environmental concerns traditional eutectic tin-lead solder is gradually being replaced in electronic assemblies by “lead-free” solders. During this transition, nanoparticle technology is also being investigated to see whether improvements in joint reliability for high temperature applications can be made. Nanoparticles can be used to harden the solder via Zener pinning of the grain boundaries and reduce fatigue failure. This paper explores the effects of adding Silica nanoparticles to SnAgCu solder, and how the mechanical properties induced in the solder vary with temperature. It is found that above 100 °C the mechanical response and microstructure of the normal and nanoparticle enhanced solders converge.

Type
Research Article
Copyright
Copyright © Materials Research Society 2012

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