Skip to main content Accessibility help
×
Home
Hostname: page-component-564cf476b6-44467 Total loading time: 0.137 Render date: 2021-06-21T06:35:22.124Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true }

Modeling the Impact of Packaging Stress on Device Performance

Published online by Cambridge University Press:  01 February 2011

Xiaopeng Xu
Affiliation:
TCAD R&D, Synopsys, Inc. 700 E. Middlefield Rd, Mountain View, CA 94043, USA
Victor Moroz
Affiliation:
TCAD R&D, Synopsys, Inc. 700 E. Middlefield Rd, Mountain View, CA 94043, USA
Get access

Abstract

In this study the stress evolution for the entire transistor fabrication process is simulated and the packaging stress is modeled as the external pressure/normal stress acting on the boundaries of the transistor unit cell. The impact on device performance from both the fabrication stress and the packaging stress is investigated using a classical piezo-resistance mobility model. The effect of the packaging stress on device mobility can be either beneficial or detrimental depending on whether the stress is tensile or compressive, on stress pattern, its magnitude, and the transistor type. The results suggest that utilizing both the fabrication stress and the packaging stress for stress engineering can lead to additional device performance enhancements.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below.

References

1. Ghani, T. et al, IEDM Proceedings, 978, (2003).Google Scholar
2. Thompson, S. E.et al, IEEE Electron Dev. Lett., 25, 191, (2004).CrossRefGoogle Scholar
3. Jian, C. and Wolf, I. De, Proc. Third Electronics Packaging Technology Conference, (2000).Google Scholar
4. Moroz, V.et al, Materials Science in Semi. Processing, 6, 27, (2003).Google Scholar
5. Smith, C. S., Phys. Rev., 94, 42 (1954).CrossRefGoogle Scholar
6. Moroz, V.et al, Solid-State Technology, June, (2004).Google Scholar
7. Synopsys TCAD tool suite manuals, (2005).Google Scholar
8. Moroz, V. and Xu, X., to appear in ECS proceedings, (2005).Google Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Modeling the Impact of Packaging Stress on Device Performance
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Modeling the Impact of Packaging Stress on Device Performance
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Modeling the Impact of Packaging Stress on Device Performance
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *