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Modeling of Cu Surface Precipitation and Out-Diffusion from Silicon Wafers

Published online by Cambridge University Press:  01 February 2011

Hsiu-Wu Guo
Affiliation:
hwg@u.washington.edu, University of Washington, Electrical Engineering, University of Washington, Dept. of Electrical Engineering,, Paul Allen Center - Room AE100R, Seattle, WA, 98195-2500, United States, (206)616-4450
Scott T. Dunham
Affiliation:
dunham@ee.washington.edu, University of Washington, Electrical Engineering, Seattle, WA, 98195-2500, United States
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Abstract

Copper is one of the most concerned contaminants for silicon process, due to its detrimental effects on device performance if present in active regions. Gettering of Cu by changing the surface conditions at the wafer surface is commonly used. Acceleration of Cu out-diffusion and surface precipitation was observed with changes of the surface potential, which could be altered by both existing Cu precipitates and organics at the surface. In this work, physically based models are developed to describe the Cu evolution at the wafer surface including the dependence of surface potential. These models are verified by comparison to the experiment measurements from Ohkubo et al. [Jpn. J. Appl. Phys. 1 44, 3793 (2005)].

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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