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Microstructures and Mechanical Properties of MoSi2 / Mo5Si3 / Mo5Si3C Ternary Eutectic Composite

Published online by Cambridge University Press:  12 February 2015

Hirotaka Matsunoshita
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
Kosuke Fujiwara
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
Yuta Sasai
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
Yuichiro Kondo
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
Kyosuke Kishida
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan Center for Elements Strategy Initiative for Structural Materials (ESISM), Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
Haruyuki Inui
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan Center for Elements Strategy Initiative for Structural Materials (ESISM), Kyoto University, Sakyo-ku, Kyoto 606-8501, Japan
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Abstract

Microstructures and mechanical properties of directionally solidified (DS) MoSi2 / Mo5Si3 / Mo5Si3C ternary eutectic composites were investigated. Ternary eutectic microstructure of a script-lamellar type that is characterized by rod-shaped Mo5Si3 and Mo5Si3C phases extending along the growth direction in the MoSi2 single crystalline matrix was developed simply by directional solidification at a growth rate of 10 mm/h. Compression tests along $[{\rm{1}}\mathop 1\limits^- 0]_{MoSi_2 }$ nearly parallel to the growth direction revealed that the DS ternary eutectic composites were plastically deformed above 1000 °C. Yield stresses of the DS ternary eutectic composites were much higher than those of binary composites mainly because of a smaller average thickness of MoSi2 matrix.

Type
Articles
Copyright
Copyright © Materials Research Society 2015 

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References

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