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Microscopic Measurements of Electromigration Damage Using Electrical Measurements

Published online by Cambridge University Press:  15 February 2011

Brian K Jones
Brian K Jones*
Affiliation:
School of Physics and Chemistry, Lancaster University, Lancaster, LA 1 4YB, United Kingdom
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Abstract

Continuous measurements have been made of the changes in several electrical quantities of Al 4%Cu tracks during the lifetime under electromigration stress. The changes in resistance, second harmonic and the second harmonic delay have been used to determine the changes in the track cross-section, resistivity and temperature. During most of the lifetime the results are consistent with a linear increase in the microscopic damage occurring uniformly throughout the track. During the final phase of the life there is evidence of large void formation with subsequent healing. Considerable information can be obtained about these processes and the extent to which they are reversible. The observed events are compared with the changes which have been predicted by specific mechanisms.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 489
Copyright
Copyright © Materials Research Society 1995

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