We have examined a series of a Si,Ge:H alloy devices deposited using both RF and VHF glow discharge in two configurations: SS/n+/i (a-SiGe:H)/p+/ITO nip devices and SS/n+/i (a-SiGe:H)/Pd Schottky contact devices, over a range of deposition rates. We employed drive-level capacitance profiling (DLCP), modulated photocurrent (MPC), and transient junction photo-current (TPI) measurement methods to characterize the electronic properties in these materials. The DLCP profiles indicated quite low defect densities (mid 1015 cm-3. to low 1016 cm-3 depending on the Ge alloy fraction) for the low rate RF (∼1Å/s) deposited a-SiGe:H materials. In contrast to the RF process, the VHF deposited a-SiGe:H materials did not exhibit nearly as rapid an increase of defect density with the deposition rate, remaining well below 1017 cm-3. up to rates as high as 10Å/s. Simple examination of the TPI spectra on theses devices allowed us to determine valence band-tail widths.. Modulated photocurrent (MPC) obtained for several of these a-SiGe:H devices allowed us to deduce the conduction band-tail widths. In general, the a-Si,Ge:H materials exhibiting narrower valence band-tail widths and lower defect densities correlated with the best device performance.