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Laser Direct-Write of Materials for Microelectronics Applications

Published online by Cambridge University Press:  10 February 2011

K. M. A. Rahman ,
D. N. Wells  and
M. T. Duignan
K. M. A. Rahman
Affiliation:
Potomac Photonics, Inc.4445 Nicole Drive Lanham, MD 20706
D. N. Wells
Affiliation:
Potomac Photonics, Inc.4445 Nicole Drive Lanham, MD 20706
M. T. Duignan
Affiliation:
Potomac Photonics, Inc.4445 Nicole Drive Lanham, MD 20706
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Abstract

We demonstrate a laser direct-write method, a maskless process that transfers material directly from a ribbon to a substrate. This process offers the promise of fabricating passive electronic micro-components at a high speed with high spatial resolution. We are developing a workstation implementing this direct-write method, which integrates deposition, direct laser sintering, and micromachining capability on a single machine. Using this workstation we have deposited micro-patterns of conducting lines and resistors on alumina and polyimide substrates under ambient conditions that exhibit good electrical properties and substrate adhesion. From preliminary studies of laser sintering it was found that a wide range of sintering conditions may be used to arrive at silver conducting lines (∼60 µm × 10 µm) on alumina substrate with resistivity in the range of 5 to 10 times the resistivity of bulk silver. Preliminary results also indicate direct laser sintering of cermet resistor material can yield reproducible resistance values.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 624: Symposium V – Materials Development for Direct Write Technologies , 2000 , 99
Copyright
Copyright © Materials Research Society 2000

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References

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