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Kinetics Of Hydrogen Evolution And Crystallization In Hydrogenated Amorphous Silicon Films Studied By Thermal Analysis And Raman Scattering

Published online by Cambridge University Press:  15 February 2011

Nagarajan Sridhar
Affiliation:
Center for Electronic and Electro-Optic Materials, State University of New York at Buffalo, NY 14260–4400, and J. Coleman, Plasma Physics Corp., P. O. Box 548, Locust Valley, NY 11650.
D. D. L. Chung
Affiliation:
Center for Electronic and Electro-Optic Materials, State University of New York at Buffalo, NY 14260–4400, and J. Coleman, Plasma Physics Corp., P. O. Box 548, Locust Valley, NY 11650.
W. A. Anderson
Affiliation:
Center for Electronic and Electro-Optic Materials, State University of New York at Buffalo, NY 14260–4400, and J. Coleman, Plasma Physics Corp., P. O. Box 548, Locust Valley, NY 11650.
W. Y. Yu
Affiliation:
Center for Electronic and Electro-Optic Materials, State University of New York at Buffalo, NY 14260–4400, and J. Coleman, Plasma Physics Corp., P. O. Box 548, Locust Valley, NY 11650.
L. P. Fu
Affiliation:
Center for Electronic and Electro-Optic Materials, State University of New York at Buffalo, NY 14260–4400, and J. Coleman, Plasma Physics Corp., P. O. Box 548, Locust Valley, NY 11650.
A. Petrou
Affiliation:
Center for Electronic and Electro-Optic Materials, State University of New York at Buffalo, NY 14260–4400, and J. Coleman, Plasma Physics Corp., P. O. Box 548, Locust Valley, NY 11650.
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Abstract

We observed the processes of hydrogen evolution and crystallization in hydrogenated Amorphous silicon 0.5–7 μm thick films (deposited by dc glow discharge on Molybdenum) by differential scanning calorimetry (DSC), Raman scattering and thermogravimetric analysis (TGA). Investigation was made as a function of doping, deposition temperature and film thickness. For all the films, an endothermic DSC peak was observed at 694 °C (onset). That this peak was at least partly due to hydrogen evolution was shown by TGA, which showed weight loss beginning at 694 °C, and by evolved gas analysis, which showed hydrogen evolution at 694 °C. This temperature (658–704 °C) increased with increasing heating rate (5–30 °C/min). Doping reduced this temperature from 694 to 625 °C for boron doping and to 675 °C for phosphorous doping. Hydrogen evolution kinetics and FTIR results suggest that the silicon-hydrogen bonding in the intrinsic film was a mixture of SiH and S1H2, and was predominantly SiH in the phosphorous doped films and SiH2 in the boron doped films. Crystallization was independent of silicon-hydrogen bonding in the as-deposited Amorphous silicon film. It was bulk (not interface) induced. No exothermic DSC peak accompanied the crystallization. The film deposition temperature had little effect on the DSC result, but crystallization was enhanced by a higher deposition temperature.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

1. Carlson, D. E. and Wronski, C. R., Appl. Phys. Lett. 28, 671 (1976).Google Scholar
2. Carlson, D. E., J. Non-Cryst. Solids 35–36, 707 (1980).Google Scholar
3. Staebler, D. L. and Wronski, C. R., Appl. Phys. Lett. 39, 292 (1977).Google Scholar
4. Yoon, H. S., Park, C. S. and Park, Sin-Chong, J. Vac. Sci. Technol. A 4 (6), 3095 (1986).Google Scholar
5. Hatalis, M. K. and Greve, D., J. Appl. Phys. 63, 2260 (1988).Google Scholar
6. Street, R. A., Hydrogenated Amorphous silicon (Cambridge University Press, Cambridge, 1991) and references cited in.Google Scholar
7. Sinke, W. C., Warabisako, T., Miyao, M., Tokuyama, T., Roorda, S. and Saris, F. W., J. Non-Cryst. Solids 99, 308 (1988).Google Scholar
8. Paul, W., Lewis, A. J., Connell, G. A. N. and Moustakas, T. D., Solid State Comm. 20, 969 (1976).Google Scholar
9. Beyer, W., Wagner, H. and Mell, H., Solid State Comm. 39, 375 (1981).Google Scholar
10. Kumeda, M., Komatsu, H. and Shimizu, T., Thin Solid Films 129, 227 (1985).Google Scholar
11. Battezzatti, L., Demichelis, F., Pirri, C. F., Tagliaferro, A. and Tresso, E., J. Non-Cryst. Solids 137 & 138, 87 (1991).Google Scholar
12. Battezzatti, L., Demichelis, F., Pirri, C. F. and Tresso, E., PhysicaB 176, 73 (1992).Google Scholar
13. Beyer, W. and Wagner, H., J. Appl. Phys. 53, 8745 (1982).Google Scholar
14. Beigelson, D. K., Street, R. A., Tsai, C. C. and Knights, J. C., Phys. Rev. B 20, 4839 (1979).Google Scholar
15. CRC Handbook of Chemistry and Physics (CRC, West Palm Beach, FL, 1977).Google Scholar
16. Roth, J. A., Olson, G. L., Jacobson, D. C. and Poate, J. M., Mat. Res. Symp. Proc. 297 (1993).Google Scholar
17. Olson, G. L. and Roth, J. A., Mater. Sci. Rep. 3, 1 (1988).Google Scholar
18. Masaki, Y., LeComber, P. G. and Fitzgerald, A. G., J. Appl. Phys. 74, 129 (1993).Google Scholar
19. Licoppe, C. and Nissim, Y. I., J. Appl. Phys. 59, 432 (1986).Google Scholar
20. Zellama, K., Squelard, S., Magarino, J. and Kaplan, D., J. Non-Cryst. Solids 59 &60, 807 (1983).Google Scholar
21. Magarino, J., Kaplan, D., Friederich, A. and Deneuville, A., Phil. Mag. 45, 285 (1980).Google Scholar
22. Chou, J. C., Hsiung, S. K. and Lu, C. Y., Jpn. J. Appl. Phys. 26, 1971 (1989).Google Scholar
23. Fan, J. C. C. and Anderson, C. H. Jr, J. Appl. Phys. 52, 4003 (1981).Google Scholar
24. Donovan, E. P., Spaepen, F., Turnbull, D., Poate, J. M. and Jacobson, D. C., J. Appl. Phys. 57, 1795 (1985).Google Scholar
25. Hasegawa, S., Sakamoto, S., Inokuma, T. and Kurata, Y., Appl. Phys. Lett. 62, 1218 (1993).Google Scholar
26. Roorda, S., Kammann, D., Sinke, W. C., Van de Walle, G. F. A. and Van Gorkum, A. A., Mater. Lett. 9, 259 (1990).Google Scholar