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Instantaneous Fluid Film Imaging in Chemical Mechanical Planarization

Published online by Cambridge University Press:  01 February 2011

Daniel Apone ,
Caprice Gray ,
Chris Rogers ,
Vincent P. Manno ,
Chris Barns ,
Mansour Moinpour ,
Sriram Anjur  and
Ara Philipossian
Daniel Apone
Affiliation:
Tufts University, Department of Mechanical Engineering, Medford, MA, USA
Caprice Gray
Affiliation:
Tufts University, Department of Mechanical Engineering, Medford, MA, USA
Chris Rogers
Affiliation:
Tufts University, Department of Mechanical Engineering, Medford, MA, USA
Vincent P. Manno
Affiliation:
Tufts University, Department of Mechanical Engineering, Medford, MA, USA
Chris Barns
Affiliation:
Intel Corporation, Santa Clara, CA, USA
Mansour Moinpour
Affiliation:
Intel Corporation, Santa Clara, CA, USA
Sriram Anjur
Affiliation:
Cabot Microelectronics Corporation, Aurora, IL, USA
Ara Philipossian
Affiliation:
University of Arizona, Department of Chemical Engineering, Tucson, AZ, USA
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Abstract

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W2.3
Copyright
Copyright © Materials Research Society 2005

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References

1. Runnels, S R and Eyman, L M. Tribology analysis of chemical-mechanical polishing. Journal of the Electrochemical Society, 141(6):1698–1701, 1994.Google Scholar
2. Thakurta, D G, Borst, C L, Schwendeman, D W, Gutmann, R J, and Gill, W N. Pad porosity, compressibility and slurry delivery effects in chemical mechanical planarization: Modeling and experiments. Thin Solid Films, 336:181–190, 2000.Google Scholar
3. Ng, S H, Hight, R, Zhou, C, Yoon, I, and Danyluk, S. Pad soaking effect on interfacial fluid pressure measurements during cmp. Transactions of the ASME, 125:582–586, 2003.Google Scholar
4. Kim, H J, Kim, H Y, Jeong, H D, Lee, E S, and Shin, Y J. Friction and thermal phenomena in chemical mechanical polishing. Journal of Materials Processing Technology, 130-131:334–338, 2002.Google Scholar
5. Hocheng, H and Huang, Y L. In situ endpoint detection by pad temperature in chemical mechanical polishing of copper overlay. IEEE Transactions on Semiconductor Manufacturing, 17:180–187, 2004.Google Scholar
6. Hidrovo, C H and Hart, D P. Emission reabsorption laser induced fluorescence (erlif) film thickness measurement. Measurement Science and Technology, 12:467–477, 2001.Google Scholar
7. Sakakibara, J and Adrian, R J. Whole field measurement of temperature in water using two-color laser induced fluorescence. Experiments in Fluids, 26:7–15, 1999.Google Scholar