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Ink Jet Printing Devices and Circuits

Published online by Cambridge University Press:  31 January 2011

Steven Ready
Affiliation:
ready@parc.com
Ana Arias
Affiliation:
aarias@parc.com, Palo Alto Research Center, Inc., Palo Alto, California, United States
Sanjiv Sambandan
Affiliation:
ssamband@parc.com, Palo Alto Research Center, Inc., Palo Alto, California, United States
Robert Street
Affiliation:
street@parc.com, Palo Alto Research Center, Inc., Palo Alto, California, United States
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Abstract

For several years there have been many efforts to employ ink jet technologies in the fabrication of consumer electronics. The potential of displacing large and expensive pieces of electronic fabrication equipment and processes with seemingly appropriately scaled inexpensive alternatives is attractive. However, of course, the devil is in the details. Feature size, accuracy, registration and materials all have sever impacts on design rules, processing, performance and the types of devices appropriate to the technology. Here we present a look at some of the materials and deposition challenges along with solutions developed at PARC. The discussion will include the defining of printed features >5μm with ±1.5μm drop placement and layer to layer alignment accuracy, the materials characteristics of the generally complex functional fluids of interest required for reliable jetting and device performance. Examples of ink jet fabricated integrated circuits, working displays, imagers and RGB color filters for LCD displays will be shared.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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