Hostname: page-component-77c89778f8-m42fx Total loading time: 0 Render date: 2024-07-17T11:27:13.456Z Has data issue: false hasContentIssue false
  • English
  • Français

Generation of Blind Via-Holes for a High Density Multi-Chip-Module Using Excimer Lasers

Published online by Cambridge University Press:  21 February 2011

Friedrich G. Bachmann
Friedrich G. Bachmann*
Affiliation:
Siemens AG, Corporate Production and Logistics Department, Otto-Hahn-Ring 6, D-8000 MOnchen 83, Fed. Rep. Germany
Get access

Abstract

In recent years the on-chip delay has gone down much more rapidly than the signal delay in packaged circuits. As a consequence of this the packaging delay times have had to be reduced drastically, which means that a greater packging density had to be implemented. A novel planar packaging technique, used in the new Siemens main frame computer 7500 H 90 has led to considerable progress in solving this problem. An essential part of this system is a multi-chip-module which can hold up to 144 bare chips. The carrier of these IC's is a 16-layer high density multilayer printed circuit board, which is fabricated in a sequential process. Interlayer contacts are formed by 80 µm wide blind via-holes, which are generated by excimer-laser ablation of the dielectric. The process desribed in this paper shows that it is possible to produce blind via-holes with an aspect ratio of about one in an extremely reliable and reproducible way. This process is already being successfully run on a production line. It is to our best knowledge the first time excimer lasers have been used on a large-scale in an industrial environment.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 158: Symposium B – In-Situ Patterning: Selective Area Deposition and Etching , 1989 , 439
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

LITERATURE

1. Gemmler, A., Bolch, T., Jostan, J.-L. : Laser in der Leiterplattentechnik. Galvanotechnik 79, 3447 (1988)Google Scholar
2. Wessely, H., Türk, W., Schmidt, K.-H., Nagel, G. : Computer Packaging. Siemens Res. & Dev. Reports 17, 5, 234 (1988)Google Scholar
3. Krauter, A., Baumann, J., Becker, M. : Assembly Process for a New Micropackaging System. Siemens Res. & Dev. Reports 17, 5, 254 (1988)Google Scholar
4. Hacke, H. J., Steckhan, H. H. : Micropack Packaging Technology. Siemens Res. & Dev. Reports 17, 5, 227 (1988)Google Scholar
5. Brösamle, H., Brabetz, B., V. v.Ehrenstein, Bachmann, F. Technology for a Microwiring Substrate. Siemens Res. & Dev. Reports 17, 5, 249 (1988) H. Brösamle : Technology for a Microwiring Substrate. Proc. Conf. IEPC, Helsingör, June 13-15, 1988 Ed. by M. G. FassiniGoogle Scholar
6. Hillebrand, F.-J. : Laserbohren in organischem Leiterplatten-Material. Feinwerktechnik & Meßtechnik 91, 56 (1983)Google Scholar
7. Korf, D. W. : Laser-Drilled Blind Vias Increase PCB Real Estate. Electronic Packaging & Production Feb. 1987, p. 56 Google Scholar
8. Srinivasan, R., Leigh, W. J. : Ablative Photodecomposition: Action of Far-Ultraviolett (193 nm) Laser Radiation on Poly(ethylene terephthalat) Films. J. Am. Chem. Soc. 104, 6784 (1982)Google Scholar
9. Srinivasan, V., Smrtic, M. A., Babu, S. V. : Excimer Laser Etching of Polymers. J. Appl. Phys. 59, 3961 (1986)Google Scholar
10. Dijkkamp, D., Gozdz, A. S., Venkatesan, T., Wu, X. D. : Evidence for the Thermal Nature of Laser-Induced Polymer Ablation. Phys. Rev. Lett. 58, 2142 (1987)Google Scholar