A wafer scrubber used in bipolar wafer front-end fabrication for particle removal showed visible evidence of deterioration. We describe the analytical work undertaken to identify the nature of the deterioration, its impact on the DI water quality exiting the nozzles and used for the high pressure scrubbing, and finally how these corrosion products manifest themselves as metal contaminants on wafer surfaces. A reasonable explanation for the long term deterioration of the tool is found in the fact that carbon dioxide has been used in the DI water at this scrub for nearly a decade. This of course acidifies the water and makes the stainless steel components more susceptible to corrosion. The scrubs are typically followed with wet chemical cleans using spray processors. The effectiveness of this clean in removing the metal contamination is incomplete. The removal of these scrubs from product log sheets has been a contributing factor in producing measurable yield improvements.