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Flexible, Lightweight Steel-Foil Substrates For a-Si:H Thin-Film Transistors

Published online by Cambridge University Press:  10 February 2011

S. D. Theiss ,
C. C. Wu ,
M. Lu ,
J. C. Sturm  and
S. Wagner
S. D. Theiss
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544
C. C. Wu
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544
M. Lu
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544
J. C. Sturm
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544
S. Wagner
Affiliation:
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544
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Abstract

For many flat panel display applications, traditional glass substrates for the TFT backplane are not sufficiently rugged. Therefore, we have begun to explore the use of steel foils as TFT substrates for emissive or reflective displays. We report the fabrication of high quality a-Si:H TFTs on lightweight, flexible 75 μm thick stainless steel foils. The electrical characteristics of the TFTs were good and were not significantly affected by either dropping over 15 meters to a concrete floor or being bent to a radius of curvature of 8.25 cm for a period of over 400 hours. Typical device characteristics were: ION/IOFF > 107, IOFF ∼ 1012 A, VT ∼ 3.2 V, and μEFF ∼ 0.9 cm2/Vs. We also discuss our recent work on the successful integration of organic light-emitting diodes (OLEDs) with TFTs on steel substrates, resulting in a new form of emissive display.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 471: Symposium G – Flat Panel Display Materials III , 1997 , 21
Copyright
Copyright © Materials Research Society 1997

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References

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