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Electromigration Failure in Thin Film Conductors Possessing a Near-Bamboo Structure
Published online by Cambridge University Press: 22 February 2011
Abstract
Electromigration failure in a near bamboo structure is investigated theoretically. Assuming that the diffusion path is interfacial, a flux divergence can be predicted based on the stress gradient induced by grain boundary electromigration in a sub Blech Length grain cluster. A possible explanation for the recently observed “trans-granular” voids is proposed.
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- Copyright © Materials Research Society 1994
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