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Effects of Environment on Modlus of Low-k Porous Films Used in Back End of Line

Published online by Cambridge University Press:  01 February 2011

Eva E Simonyi ,
Christos D Dimitrakopoulos ,
Michael Lane ,
Eric Liniger  and
Willi Volksen
Eva E Simonyi
Affiliation:
simonyi@us.ibm.com, IBM, Research, 1101 Kitchawan Rd., Yorktown Heights, NY, 10598, United States, 718-548-7145
Christos D Dimitrakopoulos
Affiliation:
dimitrak@us.ibm.com, IBM T. J. Watson Research Center, 1101 Kitchawan Rd., Yorktown Heights, NY, 10598, United States
Michael Lane
Affiliation:
mwlane@us.ibm.com, IBM T. J. Watson Research Center, 1101 Kitchawan Rd., Yorktown Heights, NY, 10598, United States
Eric Liniger
Affiliation:
eliniger@us.ibm.com, IBM T. J. Watson Research Center, 1101 Kitchawan Rd., Yorktown Heights, NY, 10598, United States
Willi Volksen
Affiliation:
volksen@almaden.ibm.com, IBM Almaden Research Center, 650 Harry Rd., San Jose, CA, 95120, United States
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Abstract

Reliability is an important requirement for the newly developed porous low-k ILD materials that are being introduced into (BEOL). Dependence of Young's moduli, as measured by nanoindentation technique, on the environment [such as high relative humidity, water immersion and recovery] is presented along with FT-IR spectra for a number of films with different k values. Effect of the moduli changes on cracking behavior is also discussed.

Keywords

dielectric propertiesfilmelastic properties
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B03-15
Copyright
Copyright © Materials Research Society 2007

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References

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