Hostname: page-component-848d4c4894-pftt2 Total loading time: 0 Render date: 2024-05-13T03:52:48.389Z Has data issue: false hasContentIssue false

The Effect of Different Oxidizing Atmospheres on the Initial Kinetics of Copper Oxidation as Studied In Situ UHV-TEM

Published online by Cambridge University Press:  10 February 2011

Mridula D. Bharadwaj
Affiliation:
Department of Material Science and Engineering, University of Pittsburgh, Pittsburgh, PA 15261
Anu Gupta
Affiliation:
Department of Material Science and Engineering, University of Pittsburgh, Pittsburgh, PA 15261
J. Murray Gibson
Affiliation:
Materials Science Division, Argonne National Laboratories, Argonne, IL 60439
Judith C. Yang
Affiliation:
Department of Material Science and Engineering, University of Pittsburgh, Pittsburgh, PA 15261
Get access

Abstract

Effect of moisture on the oxidation of copper was studied using in situ UHV-TEM. The ultra high vacuum condition is required for minimum contamination effects. The initial observations show that the water vapor reduces the oxide as well as reduces the rate of oxidation if both oxygen gas and water vapor are simultaneously used. Based on these observations, we have speculated on the role of moisture in the solid state reactions involved in copper oxidation

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Lawless, K.R., Rep. Prog. Phys., 37, 231316, (1974).Google Scholar
2.Ashcroft, N.W. and Mermin, N.D., Solid State Physics, Philadelphia, PA: Saunders College, 1976.Google Scholar
3.Ohba, T., Applied Surface Science, 91, 1, (1995).Google Scholar
4.Roennquist, A. and Fischmeister, H., Journal of Institute of Metals, 89, 65, (1960-1961).Google Scholar
5.Pearson, W.B., Pearson‘s Handbook of Crystallographic Data for Intermetallic Phases, Ohio: American Society for Metals, Menlo Park, 1985.Google Scholar
6.Yang, J.C., Yeadon, M., Kolasa, B. and Gibson, J.M., Scripta Materialia, 38,1237 (1998).Google Scholar
7.Yang, J.C., Yeadon, M., Kolasa, B. and Gibson, J.M., Applied Physics Letters, 70,35223524, (1997).Google Scholar
8.Tuck, C.W., Odgers, M. and Sachs, K., Corros.Sci., 9, 271295, (1969).Google Scholar
9.Milne, R.H. and Howie, A., Philosophical Magazine A, 49,665682 (1984).Google Scholar
10.Goulden, D.A., Philosophical Magazine, 33,393408, (1976).Google Scholar
11.Lawless, K. and Mitchell, D., Memoires Scientifiques Rev. Metallur., LXII, 1745, (1965).Google Scholar
12.Heinemann, K., Douglas, D.L., Oxidation of Metals, 9,379459, (1975).Google Scholar
13.McDonald, M.L., Gibson, J.M. and Unterwald, F.C., Rev. Sci. Instrum., 60,700, (1989).Google Scholar
14.Yang, J.C., Yeadon, M., Olynick, D. and Gibson, J.M., Microscopy and Microanalysis, 3(2), 121, (1997).Google Scholar
15.Frances, S., Leibsle, F., Haq, S., Xiang, N. and Bowker, M., Surf. Sci., 315, 284, (1994).Google Scholar
16.Swalin, Richard A., Thermodynamics of Solids, 2nd ed. (Wiley-Interscience Publishers, 1972), p. 116.Google Scholar
17.Pilling, N.B. and Bedworth, M.S., Journal of Inst. Metals, xxix, 529–82 (1923).Google Scholar