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Effect of Aqueous Solution Chemistry on the Accelerated Cracking of Lithographically Patterned Arrays of Copper and Nanoporous Thin-Films
Published online by Cambridge University Press: 17 March 2011
Abstract
The effect of moisture and aqueous solution chemistry on the rate of crack growth in lithographically patterned arrays of copper and low dielectric constant (LKD) materials is reported. Crack growth in the direction orthogonal to the features is demonstrated to fail at significantly increased loads compared to parallel cracking. Decreasing feature width is also shown to increase the structures resistance to fracture, particularly at reduced loads. The chemical interactions and mechanisms of energy dissipation are discussed.
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- Copyright © Materials Research Society 2004
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