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Effect of Ag Content on Electrical Conductivity and Tensile Properties of Cu-Ti-Ag Alloys

Published online by Cambridge University Press:  25 March 2011

Taek-Kyun Jung ,
Dong-Woo Joh ,
Hyo-Soo Lee  and
Hyuk-Chon Kwon
Taek-Kyun Jung
Affiliation:
Korea Institute of Industrial Technology, 7-47 Songdo-dong, Yeonsu-gu, Incheon 406-840, Korea.
Dong-Woo Joh
Affiliation:
Korea Institute of Industrial Technology, 7-47 Songdo-dong, Yeonsu-gu, Incheon 406-840, Korea.
Hyo-Soo Lee
Affiliation:
Korea Institute of Industrial Technology, 7-47 Songdo-dong, Yeonsu-gu, Incheon 406-840, Korea.
Hyuk-Chon Kwon
Affiliation:
Korea Institute of Industrial Technology, 7-47 Songdo-dong, Yeonsu-gu, Incheon 406-840, Korea.
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Abstract

Effects of Ag content on microstructure, mechanical properties, and electrical conductivity in long time aged Cu-Ti-Ag alloys were investigated. In short time ageing condition, both electrical conductivity and mechanical properties were enhanced by Ag addition. On the other hand, in long time ageing condition, Ag addition showed a faster deterioration of mechanical properties than Ag free CuTi alloys.

Keywords

Cuelectrical propertiesmicrostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1297: Symposium P – Deformation Mechanisms, Microstructure Evolution and Mechanical Properties of Nanoscale Materials , 2011 , mrsf10-1297-p10-29
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

[1] Semboshi, S., Nishida, T., Numakura, H., Mater. Sci. Eng. A 517 (2009) 105–113 Google Scholar
[2] Batra, I.S., Laik, A., Kale, G.B., Dey, G.K., Kulkarni, U.D., Mater. Sci. Eng. A 402 (2005) 118–125 Google Scholar
[3] Wang, X., Zhao, J., He, J., Mater. Sci. Eng. A 460–461 (2007) 69–76 Google Scholar
[4] Markandeya, R., Nagarjuna, S., Sarma, D.S., Mater. Sci. Eng. A 371 (2004) 291–305 Google Scholar
[5] Nagarjuna, S., Srininvas, M., Balasubramanian, K., Sarma, D.S., Mater. Sci. Eng. A 259 (1999) 34–42 Google Scholar
[6] Semboshi, S., Al-Kassab, T., Gemma, R., Kirchheim, R., Ultramicroscopy 109 (2009) 593–598 Google Scholar
[7] Gaganov, A., Freudenberger, J., Botcharova, E., Schultz, L., Mater. Sci. Eng. A 437(2006) 313–322 Google Scholar
[8] Dutkiewicz, J., Metall. Trans. A 8 (1977) 751 Google Scholar