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Deposition of Molten Eutectic Solder using Jet Printing Techniques

Published online by Cambridge University Press:  21 February 2011

Michael D. Snyder  and
Ronald Lasky
Michael D. Snyder
Affiliation:
Universal Instruments Corporation, P.O. Box 825, Binghamton, NY 13902-0825
Ronald Lasky
Affiliation:
Universal Instruments Corporation, P.O. Box 825, Binghamton, NY 13902-0825
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Abstract

This paper discusses the use of Ink Jet printing techniques to dispense small (50 to 75 micrometer diameter) particles of molten eutectic solder individually at programmable dispense rates from drop on demand to several thousand per second. Alternative jet dispensing techniques are discussed. The technology could allow the selective application of programmable amounts of solder on precision circuit boards and wafer substrates, while avoiding the high cost and flexibility limits associated with hard tooling. Large solder features can be constructed by dispensing individual droplets and relying on surface tension to draw them together to form a large single feature. Alternatively, columnar features can be created by successively dispensing solder droplets at the same site, allowing time between successive droplets to avoid forming a single large spherical feature.

Several potential application areas in industry are discussed along with some of the issues associated with the projected performance of the method in the accuracy and speed domains.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 201
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1. Hayes, D. J., Wallace, D. B., Boldman, M.T., and Marusak, R. E., Int. J. Microcircuits and Electronic Packaging, Vol.16, No. 3, pp. 173–180, 1993.Google Scholar
2. Priest, J., Jacobs, E., Holt, B., and Hammerschlag, B., Int. J. Microcircuits and Electronic Packaging, Vol.17, No. 3, pp. 219–227, 1994.Google Scholar
3. Rayleigh, J.W. S., “On the Capillary Phenomena of Jets,” Proceedings of the Royal Society, Vol xxix, pp. 71–97, 1879.Google Scholar
4. Hayes, D. J., Wallace, D. B., Application of Ink Jet Technology to Dispensing in the Electronics and Semiconductor Industries, Microelectronics Interconnect Conference, August, 1987, Glenden, OregonGoogle Scholar
5. Schiesser, T., Menard, E., Smith, T., and Akin, J., Micro Dynamic Solder Pump: Drop on Demand Eutectic SnPb Solder Dispensing Device, Proceedings of NEPCON West 1995.Google Scholar
6. UIC TAB Bonder LiteratureGoogle Scholar
7. McGroarty, John, Borgesen, Peter, Yost, Boris, Li, Che-Yu, IEEE Trans. Comp., Hybrids and Manf Tech., Vol.16, No. 5, pp. 527–529, August 1993 Google Scholar