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Degradation in Sn Films due to Whisker Formation

Published online by Cambridge University Press:  26 February 2011

L. Reinbold ,
Eric Chason ,
N. Jadhav ,
V. Kelly ,
P. Holmes ,
J.W. Shin ,
W.L. Chan ,
K.S. Kumar  and
G. Barr
L. Reinbold
Affiliation:
lucine_kabakian@brown.edu
Eric Chason
Affiliation:
eric_chason@brown.edu, Brown University, Division of Engineering, United States
N. Jadhav
Affiliation:
nitin_jadhav@brown.edu
V. Kelly
Affiliation:
nitin_jadhav@brown.edu
P. Holmes
Affiliation:
Eric_Chason_PhD@brown.edu
J.W. Shin
Affiliation:
jae_w_shin@brown.edu
W.L. Chan
Affiliation:
wai_lun_chan@brown.edu
K.S. Kumar
Affiliation:
wai_lun_chan@brown.edu
G. Barr
Affiliation:
wai_lun_chan@brown.edu
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Abstract

Whisker formation in pure Sn coatings on Cu conductors is a serious impediment to the development of Pb-free electronics manufacturing. Understanding whisker formation is complicated by the fact that it is the result of multiple materials kinetic processes including interdiffusion, intermetallic formation and stress generation We report preliminary studies of whisker growth kinetics and stress evolution aimed at developing a fundamental understanding of the whisker growth process. A proposed model of point defect mediated stress generation provides a simple picture of how the different processes are connected.

Keywords

coatingSnpackaging
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 887: Symposium Q – Degradation Processes in Nanostructured Materials , 2005 , 0887-Q11-01
Copyright
Copyright © Materials Research Society 2006

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References

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