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Current Localization, Non-Uniform Heating, and Failures of ZnO Varistors

Published online by Cambridge University Press:  10 February 2011

M. Bartkowiak*
Affiliation:
Department of Physics and Astronomy, University of Tennessee, Knoxville, TN 37996–1200, and Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831–6030, bartkowiakm@ornl.gov
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Abstract

Non-uniform heating of ZnO varistors by electrical pulses occurs on three different spatial scales: (1) microscopic (sub-micron), (2) intermediate (sub-millimiter), and (3) macroscopic (of order of millimeters or centimeters). Heating on these scales has different origins and different consequences for device failure in large and small varistors. On the microscopic scale, the heating localizes in strings of tiny hot spots. They occur at the grain boundaries in a conducting path where the potential is dropped across Schottky-type barriers. These observations are interpreted by applying transport theory and using computer simulations. It is shown that the heat transfer on a scale of the grain size is too fast to permit temperature differences that could cause a varistor failure. On an intermediate size scale, the heating is most intense along localized electrical paths. The high electrical conductivity of these paths has microstructural origin, i.e., it derives from the statistical fluctuations of grain sizes and grain boundary properties. Current localization on the intermediate size scale appears to be significant only in small varistors. On the macroscopic scale, current localization in large blocks can be attributed to inhomogeneities in the electrical properties which originate during ceramic processing. The resulting non-uniform heating is shown to cause destructive failures of large varistor blocks.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

[1] Levinson, L.M. and Philipp, H.R., Ceram. Bull. 65, 639 (1986).Google Scholar
[2] Gupta, T.K., J. Am. Ceram. Soc. 73, 1817 (1990).Google Scholar
[3] Eda, K., J. Appl. Phys. 56, 2948 (1984).Google Scholar
[4] Lat, M.V., IEEE Trans. Power Appar. Syst. 102, 2194 (1983).Google Scholar
[5] Horiguchi, S., Ichikawa, F., Mizukoshi, A., Kurita, K. and Shirakawa, S., IEEE Trans. Power Delivery 3, 1666 (1988).Google Scholar
[6] Bartkowiak, M., Comber, M.G. and Mahan, G.D., J. Appl. Phys. 79, 8629 (1996).Google Scholar
[7] Bartkowiak, M., Comber, M.G. and Mahan, G.D., accepted for publication in IEEE Trans. Power Delivery. Google Scholar
[8] Hohenberger, G., Tomandl, G., Ebert, R., and Taube, T., J. Am. Ceram. Soc. 74, 2067 (1991).Google Scholar
[9] Mizukoshi, A., Ozawa, J., Shirakawa, S., and Nakano, K., IEEE Trans. Power Appar. Syst. 102, 1384 (1983).Google Scholar
[10] Wang, H., Bartkowiak, M., Modine, F.A., Dinwiddie, R.B., Boatner, L.A., and Manan, G.D., accepted for publication in J. Am. Ceram. Soc. Google Scholar
[11] Sakshaug, E.C., Burke, J.J., and Kresge, J.S., IEEE Trans. Power Delivery 4, 2076 (1989).Google Scholar
[12] Ringler, K.G., Kirkby, P., Erven, C.C., Lat, M.V., and Malkiewicz, T.A., IEEE Trans. Power Delivery 12, 203 (1997).Google Scholar
[13] Vojta, A. and Clarke, D.R., J. Appl. Phys. 81, 985 (1997).Google Scholar
[14] Cao, Z.-C., Wu, R.-J., and Song, R.-S., Mater. Sci. and Engr. B 22, 261 (1994).Google Scholar
[15] Bartkowiak, M. and Mahan, G.D., Phys. Rev. B 51 10825 (1995).Google Scholar
[16] Bartkowiak, M., Mahan, G.D., Modine, F.A., and Alim, M.A., J. Appl Phys. 79, 273 (1996).Google Scholar
[17] Bartkowiak, M., Mahan, G.D., Modine, F.A., Alim, M.A., Lauf, R.J., and McMillan, A.D., J. Appl. Phys. 80, 6516 (1996).Google Scholar
[18] Nan, C.-W. and Clarke, D., J. Am. Ceram. Soc. 79, 3189 (1996).Google Scholar
[19] Pike, G.E., Kurtz, S.R., Gourley, P.L., Phillips, H.R., and Levinson, L.M., J. Appl. Phys. 57, 1552 (1985).Google Scholar
[20] Rossinelli, M., Blatter, G., and Greuter, F., British Ceram. Proc. 36, 1 (1985).Google Scholar
[21] Greuter, F., Blatter, G., Rossinelli, M., and Stucki, F., Ceramic Trans. 3, 31 (1989).Google Scholar