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Characterization of texture and microstructure of electrodeposited Ni layers

Published online by Cambridge University Press:  01 February 2011

Homuro Noda
Affiliation:
noda.h.ab@m.titech.ac.jp, Tokyo institute of technology, Department of Materials Science and Engineering, Yokohama, Japan
Akinobu Shibata
Affiliation:
shibata@pi.titech.ac.jp, Tokyo institute of technology, Precision and Intelligence Laboratory, Yokohama, Japan
Masato Sone
Affiliation:
sone.m.aa@m.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, Yokohama, Japan
Chiemi Ishiyama
Affiliation:
cishiyam@pi.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, Yokohama, Japan
Yakichi Higo
Affiliation:
yhigo@pi.titech.ac.jp, Tokyo institute of technology, Precision and Intelligence Laboratory, Yokohama, Japan
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Abstract

The texture and microstructure of electrodeposited Ni layers formed in an additive-free Watt's bath were investigated. The microstructure of the electrodeposited Ni layer consists of fine columnar grains extending along the growth direction. The major texture components of electrodeposited Ni layers on Ni-P substrate were (112) and (110) fibers. On the other hand, electrodeposited Ni layers on Cu substrate had a strong (110) fiber texture. In the vicinity of the interface between the electrodeposited Ni layer and the Cu substrate, obvious epitaxial regions were not observed. Many twins parallel to the growth direction were observed in the electrodeposited Ni layer. It is suggested that grains with a twin relationship grew preferentially during the electrodeposition reaction.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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References

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