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Aerosol Jet Cleaning of Silicon Wafer Surfaces

Published online by Cambridge University Press:  21 February 2011

Po-Sheng Chang ,
James R. Brock  and
Isaac Trachtenberg
Po-Sheng Chang
Affiliation:
Department of Chemical Engineering, The University of Texas at Austin, Austin, TX 78712
James R. Brock
Affiliation:
Department of Chemical Engineering, The University of Texas at Austin, Austin, TX 78712
Isaac Trachtenberg
Affiliation:
Department of Chemical Engineering, The University of Texas at Austin, Austin, TX 78712
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Abstract

A new wafer cleaning technique, Aerosol Jet Cleaning (AJC), using a supersonic liquid aerosol jet was studied. AJC has been used to remove effectively both particulate and thin film contaminants from silicon wafer surfaces. Submicron polystyrene latex spheres, micron sized spherical silica particles and irregular silicon dust were successfully removed from silicon substrates using a supersonic ultrafine liquid methanol aerosol jet. The cleaning efficacy of the methanol AJC for thin film contaminants such as fingerprints has also been shown to be very effective. Surface roughness of silicon substrates before and after clean-up by AJC was measured with an atomic force microscope and virtually no change in surface roughness was observed in these studies.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 315: Symposium Y – Surface Chemical Cleaning and Passivation for Semiconductor Processing , 1993 , 249
Copyright
Copyright © Materials Research Society 1993

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References

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