Skip to main content Accessibility help
×
Home
Hostname: page-component-cf9d5c678-ljdsm Total loading time: 0.148 Render date: 2021-07-28T01:26:55.726Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true, "newUsageEvents": true }

The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP

Published online by Cambridge University Press:  01 February 2011

Jae-Hoon Song
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Ja-Hyung Han
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Yi-Koan Hong
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Young-Jae Kang
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Jin-Goo Park
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Ju-Ho Maeng
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Young-Man Won
Affiliation:
Div of Materials and Chemical Engineering, Hanyang University, Ansan, 426-791, Korea +82-31400-5226, +82-31-417-3701, jgpark@hanyang.ac.kr
Get access

Abstract

The adhesion force of pad and alumina were experimentally and theoretically investigated in slurry solutions of different pHs. The isoelectric point (IEP) of pad particles was measured to be around pH 3. The wafer surfaces showed negative zeta potentials in the investigated pH ranges with exception of FSG and Ta. Cu and Ta showed higher interaction forces than dielectric materials. The lowest adhesion force was measured between pad particle and wafer surfaces in a slurry solution of pH 11. The magnitude of adhesion force of pad particles was lower than alumina particles.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Lloyd, J.R., Microelectron. Reliab. Vol 39, pp. 15951602, (1999)CrossRefGoogle Scholar
[2] Eissa, M., Joshi, S., Shinn, G., Rafie, S. and Fraser, B., PV.99-37, pp.499505, The Electrochemicla Society Proceedings Series, Pennington, NJ (1999)Google Scholar
[3] Lee, S. Y., Lee, S.H., and park, J.G., J. Electrochem. Soc., 150, G327 (2003)CrossRefGoogle Scholar
[4] Adamson, A.W. and Gast, A.P., Physical Chemistry of Surfaces, pp. 250276, John wiely & Son, Inc. New York (1997)Google Scholar
[5] Hiemenz, P.C., Principles of Colloid and Surface Chemistry, P. 645, Marcel Dek-ker, New York (1986)Google Scholar
[6] Shaw, D. J., Introduction to Colloid and Surface Chemistry, 4th ed., p. 214, Butterworth-Heinemann Woburn, MA (1992)Google Scholar
[7] Reerink, H. and Overbeek, J. Th. G., Discuss. Foraday Soc., 18, 77 (1954)Google Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *