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Combining FIB and Automated Microcleaving Provides Fast, Accurate Cross Sections

Published online by Cambridge University Press:  14 March 2018

Janet Teshima
Janet Teshima*
Affiliation:
FEI Company & Efrat Raz, SELA USA, Inc.

Extract

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A large part of the preparation of semiconductor samples for SEM and TEM observations involves the creation of cross sections to expose subsurface defects and three-dimensional structure. A powerful new combination of FIB (FEI Company, Hillsboro, Oregon, http://www.feic.com ) with automated microcleaving technology (SELA, Santa Clara, California, http://www. sela.com ) now offers a comprehensive solution for fast, easy and accurate sample preparation.

Type
Research Article
Information
Microscopy Today , Volume 7 , Issue 7 , September 1999 , pp. 34 - 35
Copyright
Copyright © Microscopy Society of America 1999