Hostname: page-component-7479d7b7d-fwgfc Total loading time: 0 Render date: 2024-07-10T23:37:55.863Z Has data issue: false hasContentIssue false
  • English
  • Français

Towards Routine EDX Tomography in Semiconductor Failure Analysis

Published online by Cambridge University Press:  05 August 2019

Frieder H. Baumann ,
Brian Popielarski ,
Travis Mitchell  and
Yinggang Lu
Frieder H. Baumann*
Affiliation:
Globalfoundries, Malta, NY, USA.
Brian Popielarski
Affiliation:
Globalfoundries, Malta, NY, USA.
Travis Mitchell
Affiliation:
Globalfoundries, Malta, NY, USA.
Yinggang Lu
Affiliation:
Thermofisher Scientific, Hillsboro, OR, USA.
*
*Corresponding author: Frieder.Baumann@Globalfoundries.com

Abstract

An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
Image of the first page of this content. For PDF version, please use the ‘Save PDF’ preceeding this image.'
Type
Theory and Applications of Electron Tomography in the Materials Sciences
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 1820 - 1821
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Genç, A et al. , Microscopy and Analysis 116, p. 23.Google Scholar
[2]Lepinay, K et al. , Micron. 47 (2013), p. 43.Google Scholar
[3]Baumann, FH et al. , Microsc. Microanal. 22 (S3) (2016).Google Scholar
[4]Slater, TJA et al. , Ultramicroscopy 162 (2016), p. 61.Google Scholar