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Strain measurements in industrial applications: A case study of solder bumps in semiconductor devices

Published online by Cambridge University Press:  30 July 2021

Pawel Nowakowski ,
Mary Ray  and
Paul Fischione
Pawel Nowakowski
Affiliation:
E.A. Fischione Instruments, Inc., United States
Mary Ray
Affiliation:
E.A. Fischione Instruments, Inc., United States
Paul Fischione
Affiliation:
E.A. Fischione Instruments, Inc., United States

Abstract

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Type
Microscopy and Microanalysis for Real World Problem Solving
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 788 - 790
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

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