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A Simple Method to Decouple Redeposition-Related Artifacts from Real Defects in the Failure Analysis of Silicon Photonics Modules

Published online by Cambridge University Press:  05 August 2019

Fauzia Khatkhatay  and
Pradip Sairam Pichumani
Fauzia Khatkhatay*
Affiliation:
GLOBALFOUNDRIES, Inc., Malta, NY, U.S.A.
Pradip Sairam Pichumani
Affiliation:
GLOBALFOUNDRIES, Inc., Malta, NY, U.S.A.
*
*Corresponding author: fauzia.khatkhatay@globalfoundries.com

Abstract

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Type
Microscopy and Microanalysis for Real-World Problem Solving
Information
Microscopy and Microanalysis , Volume 25 , Supplement S2 , August 2019 , pp. 726 - 727
Copyright
Copyright © Microscopy Society of America 2019 

References

[1]Batten, C et al. , Performance Interconnects (2008).Google Scholar
[2]Knights, A in “Silicon Photonics: An Introduction”, (John Wiley & Sons, Ltd., Chicester).Google Scholar
[3]Hrnčíř, T et al. , ISTFA (2016), p. 642.Google Scholar
[4]The authors would like to thank Scott Darling for the mechanical cross section and their imaging.Google Scholar