The production of semiconductor chips and packaging materials involves the use of a wide array of materials, from solvents and polymers, to photoresists, to metal and dielectric layers, to conductive and thermal pastes. Characterization of these materials, both in raw form and as formulated for in-process use, is integral to successful use of them in microelectronic manufacturing. Physical and chemical analytical techniques are employed to determine parameters such as composition, cure state, and interface chemistry. More often than not, it is the successful combination of complementary analyses which provide the complete understanding of material parameters needed.

This paper reports the use of Raman microprobe spectroscopy as a characterization technique for microelectronic materials. Several examples will be given, illustrating the type of information which can be obtained and the complementary use of Raman spectroscopy in conjunction with other analytical techniques such as Fourier transform infrared spectroscopy (FTIR) and x-ray photoelectron spectroscopy (XPS) to characterize microelectronic packaging materials and organic materials used in semiconductor manufacture.