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Patterned Wafer Inspection with Multi-beam SEM Technology

Published online by Cambridge University Press:  25 July 2016

Brad Thiel ,
Maseeh Mukhtar ,
Kathy Quoi ,
Benjamin D. Bunday  and
Matt Malloy
Brad Thiel
Affiliation:
SUNY Polytechnic Institute, Albany, NY12203 SUNY Polytechnic SEMATECH, Albany, NY, 12203
Maseeh Mukhtar
Affiliation:
SUNY Polytechnic Institute, Albany, NY12203
Kathy Quoi
Affiliation:
SUNY Polytechnic Institute, Albany, NY12203
Benjamin D. Bunday
Affiliation:
SUNY Polytechnic SEMATECH, Albany, NY, 12203
Matt Malloy
Affiliation:
SUNY Polytechnic SEMATECH, Albany, NY, 12203

Abstract

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Type
Abstract
Information
Microscopy and Microanalysis , Volume 22 , Supplement S3: Proceedings of Microscopy & Microanalysis 2016 , July 2016 , pp. 586 - 587
Copyright
© Microscopy Society of America 2016 

References

[1] Thiel, B., et al., “Assessing the Viability of Multi-Electron Beam Wafer Inspection for sub-20 nm Defects”, Proc. SPIE 9236, Scanning Microscopies 2014, 92360E (2014).Google Scholar
[2] This work was funded by SEMATECH.Google Scholar